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A Micromachined Robust Planar Triggered Sparkgap Switch for High Power Pulse Applications

机译:用于高功率脉冲应用的微机械鲁棒平面触发火花隙开关

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High voltage switches capable of operating at high speeds over a wide range ofrnvoltages and energies are used in a variety of applications in material science and plasmarnphysics. Fast rising, low impedance electrical discharges from a capacitor system havernapplications ranging from transient testing of digital transmission lines to initiation of singlernand multi-point detonators in various ordnance systems.rnOf particular interest is the use of smaller scale capacitor discharges in single point,rnin-line fuzing systems such as those using slapper detonators. Semiconductor switchesrnhave been previously considered for such applications. However, the cost associated withrnsuch devices may be prohibitive in some high volume ordnance systems. Recentrndevelopment of lower voltage, low cost slapper detonators has resulted in slappers beingrnreconsidered for some comparatively inexpensive in-line systems.rnThe design, fabrication and characterization of a monolithic high voltage switch isrndiscussed which could be used with low voltage slapper detonators. The structure consistsrnof a planar electrode arrangement that is capable of standing off a potential in excess ofrn1000V. The structure can be electrically or optically triggered. The device is capable ofrnswitching high transient currents. The device can be integrally packaged with a striplinerngeometry in order to reduce interconnect parasitic impedances to a minimum.rnThe utilization of standard microelectronic fabrication techniques will be emphasizedrnin the design. This will allow for economic manufacturing in large volumes.
机译:能够在宽范围的电压和能量下高速运行的高压开关被用于材料科学和等离子物理学的各种应用中。电容器系统的快速上升,低阻抗放电具有广泛的应用范围,从数字传输线的瞬态测试到各种弹药系统中单点和多点雷管的启动。特别感兴趣的是在单点上使用较小规模的电容器放电,线引信系统,例如使用拍击雷管的引信系统。以前已经考虑将半导体开关用于这种应用。然而,与这种设备相关联的成本在某些大容量军械系统中可能是过高的。低压,低成本拍击式雷管的最新发展已导致考虑对一些相对便宜的在线系统进行拍击。讨论了可与低压拍击式雷管一起使用的整体式高压开关的设计,制造和特性。该结构由能够承受超过1000V的电势的平面电极装置组成。该结构可以被电或光学触发。该设备能够切换高瞬态电流。该器件可以与带状线几何形状整体封装,以将互连寄生阻抗降至最低。设计中将强调标准微电子制造技术的利用。这将允许进行大量经济制造。

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