Self Packaged MEMS Device

著录项

• 来源
  《Device packaging 2010》|2010年|p.1-6|共6页
• 会议地点 Scottsdale/Fountain Hills AZ(US)
• 作者

  M. Shahriar Rahman; Murali Chitteboyina; Zeynep ?elik-Butler; Donald P. Butler; rnSergio Pacheco; Ronald McBean;

  展开▼
• 作者单位

  Electrical Eng. Dept., University of Texas at Arlington, Box 19016, Arlington, TX 76019,USA;

  Electrical Eng. Dept., University of Texas at Arlington, Box 19016, Arlington, TX 76019,USA;

  Electrical Eng. Dept., University of Texas at Arlington, Box 19016, Arlington, TX 76019,USA,rnPhone:(817)2721309,FAX: (817)2727458, Email: zbutler@uta.edu, bFreescale Semiconductor;

  Electrical Eng. Dept., University of Texas at Arlington, Box 19016, Arlington, TX 76019,USA;

  Freescale Semiconductor,rn2100 E. Elliot Rd, MD: EL741, Tempe, AZ 85284, USA;

  Freescale Semiconductor,rn2100 E. Elliot Rd, MD: EL741, Tempe, AZ 85284, USA;

  展开▼
• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 制造工艺;
• 关键词