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首页> 外文会议>DSC-vol.73-1; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition pt.A; 20041113-19; Anaheim,CA(US) >BROAD-BAND OPTICAL END-POINT DETECTION FOR LINEAR CHEMICAL-MECHANICAL PLANARIZATION PROCESSES USING AN IMAGE MATCHING TECHNIQUE
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BROAD-BAND OPTICAL END-POINT DETECTION FOR LINEAR CHEMICAL-MECHANICAL PLANARIZATION PROCESSES USING AN IMAGE MATCHING TECHNIQUE

机译：图像匹配技术在线性化学机械平面化过程中的宽带光学终点检测

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摘要

In this paper we discuss an end-point detection (EPD) method for the dielectric linear chemical-mechanical planariza-tion (CMP) processes. The proposed EPD algorithms utilize the interferometry optical signals to determine the film post-thicknesses. A set of collected broadband spectral signals is formed as an spectral image. An image-matching technique is then used to match the pre-processed signal image to the reference image template obtained at the target film thickness. Several matching criteria are discussed and compared. We find that the image correlation coefficient is a good indicator to determine the process end-point. We also consider the impact of the material removal rate variations on the interferometry spectral signals. An analytical calculation is carried out to find an extraction and compression searching range of the spectral image to compensate for the removal rate uncertainties in real processes. The correctness and effectiveness of the proposed algorithms have been demonstrated through applications to an inter-metal dielectric (IMD) device CMP process. Compared with other optical EPD methods, the proposed image-matching method are robust to the CMP process variations.
机译：在本文中，我们讨论了介电线性化学机械平坦化（CMP）工艺的终点检测（EPD）方法。提出的EPD算法利用干涉光信号确定胶片的后厚度。一组收集的宽带光谱信号形成为光谱图像。然后使用图像匹配技术将预处理后的信号图像与以目标膜厚获得的参考图像模板进行匹配。讨论并比较了几种匹配标准。我们发现图像相关系数是确定过程终点的良好指标。我们还考虑了材料去除率变化对干涉光谱信号的影响。进行分析计算以找到光谱图像的提取和压缩搜索范围，以补偿实际过程中去除速率的不确定性。通过应用于金属间电介质（IMD）器件CMP工艺，已证明了所提出算法的正确性和有效性。与其他光学EPD方法相比，所提出的图像匹配方法对CMP工艺变化具有鲁棒性。

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