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首页> 外文会议>ECTC 2010;Electronic Components and Technology Conference >Novel PDMS(silicone)-in-PDMS(silicone): Low cost flexible electronics without metallization
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Novel PDMS(silicone)-in-PDMS(silicone): Low cost flexible electronics without metallization

机译：PDMS（硅树脂）-PDMS（硅树脂）中的新型PDMS（硅树脂）：低成本柔性电子产品，无需金属化

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Ω•cm) by incorporation of 80 wt% bimodal distribution of micron sized silver flakes. PDMS is both the ideal substrate and composite matrix material due to its unique properties; PDMS is optically transparent, viscoelastic, chemically and thermally stable, highly flexible, hydrophobic and can easily be molded with high resolution and aspect ratio. These unique properties of PDMS allow for high resolution molds to be prepared from photolithographically defined substrates. Screen printing of electrically conductive PDMS into these molds with micro-sized features creates a low cost, flexible electronic package. We have coined this package PDMS-in-PDMS. We show that PDMS ECA can be prepared by curing a novel formulation of PDMS at curing temperatures of 150 °C for 15 minutes. Upon curing, the ECA undergoes a transition from insulating to conductive. TMA results have shown that this transition is due to ECA shrinkage >20%. Furthermore, we show simultaneous conductivity and tensile strain measurements to show the electrical properties of PDMS ECA are unaffected by tensile strains of &x--;003E;40%. We show the feasibility of this technology to create low cost, flexible devices without the need for metallization.
机译：cm•cm），通过结合80重量％的微米级银片双峰分布。由于其独特的性能，PDMS既是理想的基材又是复合基质材料。 PDMS是光学透明的，粘弹性的，化学和热稳定的，高度柔性的，疏水的，可以轻松地以高分辨率和长宽比进行模制。 PDMS的这些独特特性允许从光刻定义的基材制备高分辨率模具。将导电PDMS丝网印刷到具有微型尺寸特征的这些模具中，可产生低成本，灵活的电子封装。我们创造了此包装PDMS-in-PDMS。我们显示可以通过在150°C的固化温度下固化PDMS的新型配方15分钟来制备PDMS ECA。固化后，ECA经历了从绝缘到导电的转变。 TMA结果表明，这种转变是由于ECA收缩> 20％而引起的。此外，我们显示了同时进行的电导率和拉伸应变测量，以显示PDMS ECA的电性能不受＆x-; 003E; 40％的拉伸应变的影响。我们展示了该技术在无需金属化的情况下创建低成本，灵活设备的可行性。

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