FLEXIBLE EPOXY FOR LOW STRESS ELECTRONIC COMPONENT ENCAPSULATION

机译：柔性环氧树脂，用于低应力电子元件封装

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The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic manufacturer and the other is from an overseas manufacturer. This report will focus on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture.

机译：以下报告将新型Thermoset ES-100柔性环氧材料与当今市场上两种最流行的柔性环氧材料的物理和机械性能进行了比较。这些材料之一来自国内制造商，另一种来自国外制造商。本报告将重点介绍这些环氧材料的热老化特性以及它们的耐化学性和耐湿性。

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《Electrical Insulation Conference and Electrical Manufacturing amp; Coil Winding Conference and Exhibition Oct 26-28, 1999, Cincinnati, Ohio》|1999年|p.453-458|共6页
会议地点 Cincinnati OH(US);Cincinnati OH(US)
作者
Michael T. Phenis;
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作者单位

Thermoset, Lord Chemical Products;

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原文格式 PDF
正文语种 eng
中图分类电工技术;
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机译：环氧树脂在电子和光电子学中的应用。第一部分。用于电子设备封装的环氧树脂的机械性能和热稳定性
3. Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation's Element of a New Electronic Component [J] . W. RMILI, M.P. DEFFARGES, F. CHALON, Journal of Electronic Materials . 2014,第3期

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4. Flexible epoxy for low stress electronic component encapsulation [C] . Phenis M.T. Electrical Insulation Conference and Electrical Manufacturing Coil Winding Conference, 1999. Proceedings . 1999

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5. Measurements and Modeling of Low-Stress Creep Deformation in Two Opto-Electronic Glass-Epoxy Joints [D] . Brown, Ryan Timothy. 2018

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6. The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation [O] . Yongcun Zhou, Yagang Yao, Chia-Yun Chen, -1

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7. Parylene C for hermetic and flexible encapsulation of interconnects and electronic components [O] . Jarboui Ahmed, Cauwe Maarten, Vermeiren Filip, 2013

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8. Finite-Element-Method Study of Stresses on Simulated Electronic Components Encapsulated in Polystyrene-Bead Foam [R] . Swanson, G. D. 1981

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FLEXIBLE EPOXY FOR LOW STRESS ELECTRONIC COMPONENT ENCAPSULATION

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