首页> 外国专利> ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE INCLUDING ELEMENT ENCAPSULATED WITH THE ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION, AND WAFER LEVEL CHIP SIZE PACKAGE

ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE INCLUDING ELEMENT ENCAPSULATED WITH THE ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION, AND WAFER LEVEL CHIP SIZE PACKAGE

机译：包封液态环氧树脂组合物，包含包封液态环氧树脂组合物的电子元件设备和晶圆级芯片尺寸包装

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摘要

PROBLEM TO BE SOLVED: To provide an encapsulating epoxy resin composition that is less liable to warp and is highly reliable in resistance to humidity, an electronic component device including elements encapsulated therewith, and a wafer level chip size package.;SOLUTION: The encapsulating epoxy resin composition includes at least a liquid epoxy resin, a curing agent, fine rubber particles, and an inorganic filler, the epoxy resin composition further containing a specific polysiloxane compound. More specifically, the encapsulating epoxy resin composition includes (A) a liquid epoxy resin, (B) an aromatic amine curing agent, (C) a polysiloxane compound having a polyester block structure (terminal: hydroxyl group) on both sides thereof, (D) fine rubber particles, (E) an inorganic filler, (F) a coupling agent, and (G) an organic solvent.;COPYRIGHT: (C)2010,JPO&INPIT

机译：解决的问题：提供一种不易翘曲并且高度耐湿的封装环氧树脂组合物，一种电子元件装置，包括与其封装的元件以及晶片级芯片尺寸封装。树脂组合物至少包括液体环氧树脂，固化剂，橡胶细颗粒和无机填料，该环氧树脂组合物还包含特定的聚硅氧烷化合物。更具体地，所述封装环氧树脂组合物包括：（A）液态环氧树脂，（B）芳族胺固化剂，（C）在其两侧具有聚酯嵌段结构（末端：羟基）的聚硅氧烷化合物，（D ）橡胶细颗粒;（E）无机填料;（F）偶联剂;（G）有机溶剂。;版权所有：（C）2010，JPO＆INPIT

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公开/公告号JP2010138384A

专利类型
公开/公告日2010-06-24

原文格式PDF
申请/专利权人 HITACHI CHEM CO LTD;
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申请/专利号JP20090254888
发明设计人 KUWANO ATSUSHI;
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申请日2009-11-06
分类号C08L63;C08L21;C08K3;C08L83/10;C08G59/50;H01L23/29;H01L23/31;C08L83/05;C08L83/07;C08G77/50;C08G77/48;
国家 JP
入库时间 2022-08-21 19:04:58

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