Liquid epoxy resins for encapsulation of integrated circuits elements

Eugeniusz Halasa

首页> 外文期刊>Polimery >Liquid epoxy resins for encapsulation of integrated circuits elements

【24h】

Liquid epoxy resins for encapsulation of integrated circuits elements

机译：用于封装集成电路元件的液态环氧树脂

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

In a review the general criteria of selection of polymers suitable for encapsulation of integrated circuits(IC)elements have been presented.The compositions(types of resins,curing and accelerating agents)and properties(shrinkage and internal stresses,adhesion)of epoxy systems used for this purpose were discussed.Various variants of casting method,especially glob-top one have been characterized among various encapsulation processes.Practical aspects of epoxy resins'using to encapsulation of IC elements were described.

机译：综述中提出了适用于封装集成电路（IC）元件的聚合物的一般选择标准。所使用的环氧体系的组成（树脂类型，固化剂和促进剂）和性能（收缩率和内应力，粘合力）为此目的，讨论了铸造方法的各种变型，特别是在各种封装工艺中表征了球顶铸型。描述了环氧树脂用于IC元件封装的实用方面。

著录项

来源
《Polimery》 |2004年第9期|共7页
作者
Eugeniusz Halasa;
展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 pol
中图分类高分子化合物工业（高聚物工业）;
关键词
encapsulation; epoxy compositions; integrated circuits; encapsulating coatings'properties;

机译：包封;环氧树脂组合物;集成电路;包封涂料性能;

相似文献

外文文献
中文文献
专利

1. Liquid epoxy resins for encapsulation of integrated circuits elements [J] . Eugeniusz Halasa Polimery . 2004,第9期

机译：用于封装集成电路元件的液态环氧树脂
2. In vivo silicon-based flexible radio frequency integrated circuits monolithically encapsulated with biocompatible liquid crystal polymers [J] . Hwang G.-T., Im D., Lee S.E., ACS nano . 2013,第5期

机译：以生物相容性液晶聚合物整体封装的体内硅基柔性射频集成电路
3. Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation's Element of a New Electronic Component [J] . W. RMILI, M.P. DEFFARGES, F. CHALON, Journal of Electronic Materials . 2014,第3期

机译：环氧树脂复合材料的动态力学性能和热效应，一种新型电子元件的封装元素
4. The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging [C] . Mingshan Yang, Jie He, Linkai Li, 2007 8th International Conference on Electronics Packaging Technology . 2007

机译：液晶环氧树脂的合成及其在大规模集成电路包装中的应用
5. Encapsulation for implanted integrated circuits: A biomedical application of vacuum deposited organic thin films. [D] . Nichols, Michael Frederick. 1992

机译：植入式集成电路的封装：真空沉积有机薄膜的生物医学应用。
6. Thermal Stability and Flame Retardancy Propertiesof Epoxy Resin Modified with Functionalized Graphene Oxide ContainingPhosphorus and Silicon Elements [O] . Maoyong Zhi, Quanyi Liu, *, 2019

机译：热稳定性和阻燃性官能化氧化石墨烯改性环氧树脂的研究磷和硅元素
7. New LED Package by Vacuum Printing Encapsulation Systems and High Reliability Transparent Liquid Type Epoxy Resin [O] . Atsushi OKUNO, Noritaka OYAMA, Yoshiteru MIYAWAKI 2003

机译：新LED封装通过真空印刷封装系统和高可靠性透明液体型环氧树脂

Liquid epoxy resins for encapsulation of integrated circuits elements

摘要

著录项

相似文献

相关主题

期刊订阅