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首页> 外文会议>Electrical, optical, and magnetic properties of organic solid-state materials IV >THERMOREVERSIBLE GELS OF POLY ANILINE: VISCOELASTIC AND ELECTRICAL PROPERTIES
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THERMOREVERSIBLE GELS OF POLY ANILINE: VISCOELASTIC AND ELECTRICAL PROPERTIES

机译：聚苯胺的热可逆凝胶：粘弹性和电学性质

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摘要

We demonstrate that polyaniline (PANI) dissolved in dodecyl benzene sulphonic acid (DBSA) shows thermoreversible gelation. The dissolution has been performed in formic acid which allows particle-free complexes according to optical microscopy. Below the gelation temperature the materials are rubber-elastic in compression experiments, the storage modulus G' does not essentially depend on frequency, and the samples are electronically conductive. Above the gelation temperature, G' indicates flow-like behavior and drastically lower ionic conductivity is observed. These results suggest reversible, i.e. fusible, network formation. The properties are compared with gels consisting of camphor sulphonic acid (CSA) doped PANI dissolved in m-cresol which are poorly thermoreversible.
机译：我们证明溶解在十二烷基苯磺酸（DBSA）中的聚苯胺（PANI）显示出热可逆凝胶化。溶解是在甲酸中进行的，根据光学显微镜，甲酸允许无颗粒的络合物。在胶凝温度以下，材料在压缩实验中具有橡胶弹性，储能模量G'基本上不依赖于频率，并且样品具有导电性。高于胶凝温度，G'表示类似流动的行为，并且观察到大大降低的离子电导率。这些结果表明可逆的，即可熔的网络形成。将该性能与由难溶性可逆性的，由溶于间甲酚的樟脑磺酸（CSA）掺杂的PANI组成的凝胶进行比较。

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  • 会议地点 Boston MA(US)
  • 作者

    O.T. Ikkala; T. Vikki; J. Ruokolainen; P. Hiekkataipale; P. Passiniemi; T. Maekelae; H. Isotalo;

  • 作者单位

    Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland;

    Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland;

    Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland;

    Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland;

    Neste Oy, P.O. Box 310, FIN-06101, Porvoo, Finland;

    VTT Electronics, Microelectronics, P.O. Box 1101, FIN-02044 VTT, Espoo, Finland;

    VTT Electronics, Microelectronics, P.O. Box 1101, FIN-02044 VTT, Espoo, Finland;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 有机质材料;
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