Optical materials in the optical circuit board are required to overcome soldering process. In detail, the material should not have absorption and shape changes after several tens of seconds heating at around 250 ℃. For such application field, we have developed a novel organic-inorganic hybrid material having a high thermal stability and low absorption at telecom wavelength. The hybrid material was designed to solvent less resin, which is free radical curable with heating at 150 ℃ or UV exposure at room temperature, for the sake of device fabrication activity. We demonstrated the waveguides fabrication by photolithography, and obtained high uniformity cured materials. Transparency of the waveguide sample at telecom wavelength was 0.10 dB/cm at 850 nm, 0.12 dB/cm at 1060 nm, 0.29 dB/cm at 1310 nm, and 0.45 dB/cm at 1550 nm. These values are good low attenuation for the Near-IR optical communication in optical interconnects. Without any further treatment such as post bake, the cured materials showed a high thermal stability. The temperature of 5 % weight loss was over 400 ℃, and the transparency hardly changed after 1 min heating at 300 ℃. In addition, the cured material showed a high refractive index of n= 1.60 at 633 nm and a low curing shrinkage about 4.7 %. From these properties, the developed organic-inorganic material is expected to be beneficial for the optical interconnection such as micro lenses and optical packages.
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机译：需要光学电路板上的光学材料来克服焊接过程。详细地讲，在250℃左右加热数十秒钟后，材料不应有吸收和形状变化。对于这样的应用领域，我们开发了一种新型的有机-无机杂化材料，该材料具有高的热稳定性和在电信波长下的低吸收性。该杂化材料设计为使用无溶剂树脂，可在150℃加热或室温暴露于紫外线下进行自由基固化，以提高器件的制造活性。我们通过光刻演示了波导的制造过程，并获得了高均匀性的固化材料。波导样品在电信波长下的透明度在850 nm处为0.10 dB / cm，在1060 nm处为0.12 dB / cm，在1310 nm处为0.29 dB / cm，在1550 nm处为0.45 dB / cm。对于光互连中的近红外光通信，这些值是很好的低衰减。无需任何进一步的处理，例如后烘烤，固化的材料显示出高的热稳定性。 5％失重的温度超过400℃，在300℃加热1分钟后，透明性几乎不变。另外，固化的材料在633nm处显示出n ＝ 1.60的高折射率和大约4.7％的低固化收缩率。从这些特性来看，开发的有机无机材料有望对微透镜和光学封装等光学互连有益。
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