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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Study of Stencil Printing Technology for Fine Pitch Flip Chip Bumping
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Study of Stencil Printing Technology for Fine Pitch Flip Chip Bumping

机译：细间距倒装芯片凸模网版印刷技术的研究

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摘要

As miniaturization is the permanent pursuit of microelectronic industry, stencil printing technology for flip chip bumping has been contributing to this trend for almost half a century. Nowadays, it's still one of the lowest cost solutions to massive manufacture of IC packaging industry. To meet the requirement of further miniaturization, this paper investigated the realization of fine pitch (about 100μm and sub 100μm) printing bumps on silicon wafers in-house. Electroformed stencil was fabricated and commercial printer was employed for bumping printing. Type-6 solder pastes (both leaded and lead-free), self-designed pallets, dummy wafers, etc., were applied in this report. This paper closely investigated the practicable industry application of the fine pitch printing technology, and showed an integrated process to acquire industry-feasible fine pitch bumps including stencil design, dummy wafer design, materials and equipment preparation, etc. The essential parameters for printing process are presented as well. Finally, the printing results showed that area arrays at pitches larger than 130μm and parallel arrays at pitches larger than 110μm were well achieved. Meanwhile, the problems on finer pitches' realization, aperture shapes, and solder wettability were brought on.
机译：由于微型化是微电子工业的永恒追求，因此，将近半个世纪以来，用于倒装芯片凸点的模版印刷技术一直在推动这一趋势。如今，它仍然是大规模制造IC封装行业的成本最低的解决方案之一。为了满足进一步小型化的要求，本文研究了内部硅晶片上细间距（约100μm和100μm以下）印刷凸点的实现。制造了电铸模版，并使用商用印刷机进行凸版印刷。本报告中使用了6类焊膏（含铅和无铅），自行设计的托盘，虚设晶圆等。本文仔细研究了细间距印刷技术在工业上的实际应用，并展示了一个集成的过程来获取行业可行的细间距凸点，包括模板设计，虚拟晶片设计，材料和设备准备等。印刷工艺的基本参数是提出了。最终，打印结果表明，间距大于130μm的区域阵列和间距大于110μm的平行阵列得到了良好的实现。同时，提出了关于更细间距的实现，孔形状和焊料润湿性的问题。

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  • 来源
  • 会议地点 Beijing(CN)
  • 作者

    Jin Yang; Jian Cai; Shuidi Wang; Songliang Jia;

  • 作者单位

    Institute of Microelectronics, Tsinghua University Tsinghua National Laboratory for Information Science and Technology (TNList)Institute of Microelectronics, Tsinghua University, Beijing, P. R. China;

    Institute of Microelectronics, Tsinghua University Tsinghua National Laboratory for Information Science and Technology (TNList)Institute of Microelectronics, Tsinghua University, Beijing, P. R. China;

    Institute of Microelectronics, Tsinghua University Tsinghua National Laboratory for Information Science and Technology (TNList)Institute of Microelectronics, Tsinghua University, Beijing, P. R. China;

    Institute of Microelectronics, Tsinghua University Tsinghua National Laboratory for Information Science and Technology (TNList) Institute of Microelectronics, Tsinghua University, Beijing, P. R. China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
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