Fracture Simulation of Solder Joint Interface by Cohesive Zone Model

机译：结合区模型模拟焊点界面断裂

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used material constitutive model in the simulation.

机译：利用有限元法和内聚力区模型，对板级电子封装中焊点在跌落冲击载荷作用下的破坏断裂进行了数值模拟。焊料-Cu焊盘界面是通过内聚区元素建模的。结果表明，在仿真中，所用材料的本构模型极大地影响了PCB侧面边缘处的断裂，并且对焊点的损伤影响很大。

著录项

来源
《Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09》|2009年|260-266|共7页
会议地点 Beijing(CN)
作者
Tong AN; Fei QIN;
展开▼
作者单位

College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing, 100124, China;

College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类包装工程;
关键词

相似文献

外文文献
中文文献
专利

1. Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model [J] . Jianpingjing, Feng Gao, Janine Johnson Engineering failure analysis . 2009,第5期

机译：使用内聚区模型模拟沿焊垫界面的动态断裂
2. Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification [J] . Nourani Amir, Akbari Saeed, Spelt Jan K. International Journal of Solids and Structures . 2016,第Null期

机译：BGA焊点的断裂载荷预测：内聚区建模和实验验证
3. Cohesive zone modelling of interface fracture near flaws in adhesive joints [J] . Peter Feraren, Henrik Myhre Jensen Engineering Fracture Mechanics . 2004,第15期

机译：胶接缝中裂纹附近界面断裂的胶合带建模
4. Fracture simulation of solder joint interface by Cohesive Zone Model [C] . International Conference on Electronic Packaging Technology High Density Packaging . 2009

机译：粘性区模型焊接接口的断裂模拟
5. FRACTURE MECHANICS OF THE BONE-CEMENT INTERFACE IN TOTAL JOINT REPLACEMENTS (NO-SLIP CRACK, COHESIVE ZONE, BIMATERIAL) [D] . CLECH, JEAN-PAUL M. 1985

机译：全关节置换中的骨水泥界面的断裂力学（无滑动裂纹，粘性区，生物材料）
6. Rate-Dependent Cohesive Zone Model for Fracture Simulation of Soda-Lime Glass Plate [O] . Dong Li, Demin Wei 2020

机译：碳酸钠-石灰玻璃板断裂模拟中的基于速率的内聚区模型
7. Cohesive zone modelling of interface fracture near flaws in adhesive joints [O] . Hansen Peter Feraren, Jensen Henrik Myhre 2004

机译：粘接接头缺陷附近界面断裂的粘性区模拟
8. Multiscale Modeling of Grain-Boundary Fracture: Cohesive Zone Models Parameterized From Atomistic Simulations [R] . Glaessgen, Edward H., Saether, Erik, Phillips, Dawn R., 2006

机译：晶界裂缝的多尺度建模：从原子模拟参数化的粘性区模型

Fracture Simulation of Solder Joint Interface by Cohesive Zone Model

摘要

著录项

相似文献

相关主题

期刊订阅