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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Failure Evaluation of Flexible-Rigid PCBs by Thermo-Mechanical Simulation
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Failure Evaluation of Flexible-Rigid PCBs by Thermo-Mechanical Simulation

机译：通过热力机械仿真评估柔性硬质PCB

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摘要

In this present work the finite element method has been used for the simulation models in order to develop tools for the early stages of product design. The objective is to develop simulation models for Flexible Printed Circuits Boards (PCBs) in a flex-rigid concept in the shape of a wrist device to evaluate its critical stress and strain when this device is submitted to thermal loading considering FR4 and Polyimide substrates as the constitutive materials of the board with BGA attached components. The critical points are the mismatch of the coefficient of thermal expansion of different materials as well as the thermoset viscoelastic nature of the polyimide. In the end of this present study it will be shown that additional research should be done to the final product. In this paper we will show the preliminary results of strain and stress distribution induced by thermo loading using a commercial finite element package.
机译：在本工作中，有限元方法已用于仿真模型，以便为产品设计的早期阶段开发工具。目的是开发一种柔性刚构概念的柔性印刷电路板（PCB）的仿真模型，其形式为腕式设备，以评估该设备在考虑FR4和聚酰亚胺基材作为热负荷的情况下承受热负荷时的临界应力和应变。具有BGA附加组件的电路板的构成材料。关键点是不同材料的热膨胀系数不匹配以及聚酰亚胺的热固性粘弹性。在本研究的最后，将表明应该对最终产品进行其他研究。在本文中，我们将显示使用商业有限元软件包由热载荷引起的应变和应力分布的初步结果。

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