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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Lifetime Prediction of an IGBT Power Electronics Module under Cyclic Temperature Loading Conditions
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Lifetime Prediction of an IGBT Power Electronics Module under Cyclic Temperature Loading Conditions

机译：循环温度负载条件下IGBT电力电子模块的寿命预测

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摘要

The lifetime of an IGBT power electronics module under cyclic temperature loading conditions has been analyzed using Finite Element Analysis method. The failure mechanisms that have been taken into account are the fatigue of the chip-mount-down solder joint, the substrate attach solder joint, the busbar solder joint and the Aluminum wirebond. The results show that the lifetime of the module is about 1000 cycles under the -40 to 125C cyclic temperature loading condition. The critical failure location has been found to be the busbar solder joint and the lack of compliance of the busbar design is the cause of the problem. The objective of this paper is to demonstrate the methodology of using physics of failure approach for the reliability analysis of power electronics modules and highlights the important design parameters that affect the thermal-mechanical fatigue failures of these components.
机译：使用有限元分析方法分析了IGBT电力电子模块在循环温度负载条件下的寿命。已考虑的故障机制是芯片安装式焊点，基板连接焊点，母线焊点和铝引线键合的疲劳。结果表明，在-40至125C的循环温度负载条件下，模块的寿命约为1000个循环。已发现关键故障位置是母线焊点，并且母线设计不合规是问题的原因。本文的目的是演示使用故障物理方法进行电力电子模块可靠性分析的方法，并重点介绍影响这些部件热机械疲劳故障的重要设计参数。

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