QUALIFICATION OF A SYSTEM-IN-PACKAGE (SiP): A PHYSICS-OF-FAILURE (PoF) PERSPECTIVE

机译：包系统（SiP）的资格：透视物理（PoF）

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An LGA (Land Grid Array) laminate-based epoxy-molded RF SiP (system-in-package) containing four wirebonded and three flip-chip dice is qualified using a PoF (Physics-of-Failure) approach. The process includes design and execution of accelerated stress testing. The test results are extrapolated to field environments using acceleration factors derived from virtual qualification (VQ) and virtual testing (VT). In the VQ step, life-cycle loading experienced by the specimen is simulated, potential failure sites are identified, and reliability assessment models for each failure mode are applied for damage analysis. The virtual testing (VT) step is similar to VQ, except that the accelerated loading developed for the experimentation phase is used. The output of the process is a lifetime assessment, based on the accelerated test results and the acceleration factors derived from PoF considerations.

机译：使用PoF（失效物理）方法对包含四个引线键合芯片和三个倒装芯片的LGA（层叠网格）基于环氧树脂的RF SiP（系统级封装）进行了鉴定。该过程包括加速压力测试的设计和执行。使用从虚拟资格（VQ）和虚拟测试（VT）得出的加速因子将测试结果外推到现场环境。在VQ步骤中，模拟样本所经历的生命周期负载，识别潜在的失效部位，并将每种失效模式的可靠性评估模型应用于损伤分析。虚拟测试（VT）步骤类似于VQ，不同之处在于，使用了为实验阶段开发的加速负载。该过程的输出是基于加速测试结果和从PoF考虑因素得出的加速因子的寿命评估。

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来源
《EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US)》|2006年|P.321-327|共7页
会议地点 ChicagoIL(US)
作者
Daniel Farley; Abhijit Dasgupta; Jo Caers;
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作者单位

University of Maryland;

Philips Applied Technologies, Electronic Packaging Thin Film;

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会议组织
原文格式 PDF
正文语种 eng
中图分类半导体器件制造工艺及设备;
关键词
N_f= Average number of cycles to failure; A,B,C= Damage model constants; ε_(pwa)= PWA flexural strain; ε_(PWA)~(failure)= PWA strain for overstress failure at quasi - static loading; ε_(PWA)= PWA flexural strain rate (sec~(-1)); ε_0= Quasi - static P;

机译：N_f =破坏的平均周期数; A，B，C =破坏模型常数;ε_（pwa）= PWA弯曲应变;ε_（PWA）〜（failure）=准静态载荷下超应力破坏的PWA应变;ε_（ PWA）= PWA弯曲应变率（sec〜（-1））;ε_0=准-静态P;
入库时间 2022-08-26 13:47:30

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QUALIFICATION OF A SYSTEM-IN-PACKAGE (SiP): A PHYSICS-OF-FAILURE (PoF) PERSPECTIVE

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