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首页> 外文会议>EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >EVOLUTION OF LEAD FREE SOLDER MATERIAL BEHAVIOR DURING ISOTHERMAL AGING
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EVOLUTION OF LEAD FREE SOLDER MATERIAL BEHAVIOR DURING ISOTHERMAL AGING

机译：等温老化过程中无铅焊料性能的演变

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摘要

Solder materials demonstrate evolving microstructure and mechanical behavior that changes significantly with environmental exposures such as isothermal aging and thermal cycling. These aging effects are greatly exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In the current study, mechanical measurements of thermal aging effects and material behavior evolution of lead free solders have been performed. Extreme care has been taken so that the fabricated solder uniaxial test specimens accurately reflect the solder materials present in actual lead free solder joints. A novel specimen preparation procedure has been developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. The tubes are then sent through a SMT reflow to re-melt the solder in the tubes and subject them to any desired temperature profile (I.e. same as actual solder joints). Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead free solders, which are commonly used as the solder ball alloy in lead free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. In our total experimental program, samples have been solidified with both reflowed and water quenching temperature profiles, and isothermal aging has been performed at room temperature (25 ℃) and elevated temperatures (100 ℃, 125 ℃ and 150 ℃). In this paper, we have concentrated on reporting the results of the room temperature aging experiments. Variations of the temperature dependent mechanical properties (elastic modulus, yield stress, ultimate strength, creep compliance, etc.) were observed and modeled as a function of room temperature aging time. Microstructural changes during room temperature aging have also been recorded for the solder alloys and correlated with the observed mechanical behavior changes.
机译：焊锡材料表现出不断发展的微观结构和机械性能，随着环境暴露（例如等温老化和热循环）而发生显着变化。在苛刻环境的电子封装的热循环鉴定测试中，典型的较高温度会大大加剧这些老化效应。在当前的研究中，已经对无铅焊料的热老化效应和材料行为演变进行了机械测量。采取了极为谨慎的措施，使制成的焊料单轴测试样品能够准确反映实际无铅焊料接头中存在的焊料材料。已经开发了一种新颖的样品制备程序，其中使用真空抽吸工艺在高精度矩形横截面玻璃管中形成焊料单轴测试样品。然后将管子通过SMT回流送出，以重新熔化管子中的焊料并使它们经受任何所需的温度曲线（即与实际的焊点相同）。使用已开发的程序制造的样品，已表征了95.5Sn-4.0Ag-0.5Cu（SAC405）和96.5Sn-3.0Ag-0.5Cu（SAC305）无铅焊料的等温时效效应和粘塑性材料行为演变。用作无铅BGA和其他组件中的焊球合金。为了进行比较，对63Sn-37Pb共晶焊料样品进行了类似测试。在我们的总体实验程序中，样品已通过回流和水淬温度曲线进行了固化，并且在室温（25℃）和升高的温度（100℃，125℃和150℃）下进行了等温老化。在本文中，我们集中于报告室温老化实验的结果。观察到随温度变化的机械性能（弹性模量，屈服应力，极限强度，蠕变柔度等）的变化，并将其建模为室温老化时间的函数。室温老化过程中的焊料合金的微观结构变化也已记录下来，并与观察到的机械性能变化相关。

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