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Lead-free solder flux removal for cleaning agent composition, lead-free solder flux removal for rinse agent, and a method of removing the lead-free solder flux
Lead-free solder flux removal for cleaning agent composition, lead-free solder flux removal for rinse agent, and a method of removing the lead-free solder flux
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机译：用于清洁剂组合物的无铅助焊剂去除，用于冲洗剂的无铅助焊剂去除以及去除无铅助焊剂的方法
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摘要
Be able to remove the lead free solder flux which comes in contact with suffering washing ones sufficiently, after the washing by the cleaner composition and the said composition where environmental load is low, with respect to substance can be satisfied the odor and inflammability etc even in the point you use immediately in order to do that washing ones, the lead free solder flux furthermore can be removed does effectively to pass, the medicine, and the said composition (and the said it does to pass, the medicine) the removal method of using is offered.(A) polyoxyalkylene phosphate surface active agent,(B) metal chelating agent, and(C) non halogen organic solventThe cleaner composition for lead free solder flux removal which is contained, andGeneral system (7):M aH b (CO3) c(In formula, as for a integer of 1 or 2, as for b integer 0 - 2, as for c integer of 1 or 2, as for M the volatile organic base is shown respectively.)So for lead free solder flux removal which includes the carbonate which is displayed it does to pass, the medicine.
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机译：通过用清洁剂组合物和上述环境负荷低的组合物进行洗涤后，能够充分地去除与遭受洗涤的接触的无铅焊剂，即使在洗涤过程中也能够满足对于物质的气味和可燃性等。为了立即进行清洗而使用的要点，还可以去除无铅助焊剂，确实有效地通过了药物，并且上述组合物（以及所说的确实通过了，药物）的去除方法（A）聚氧化烯磷酸酯表面活性剂，（B）金属螯合剂和（C）非卤素有机溶剂所含的用于清除无铅助焊剂的清洁剂组合物，以及通用体系（7）：M aH b （CO 3 ） c （在公式中，对于1或2的整数，对于b整数0-2，对于c整数1或2中的M分别表示挥发性有机碱。）清除其中包括显示确实通过的碳酸盐，药物。
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