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DOE OPTIMIZATION OF SAC 305 LEAD-FREE WAVE SOLDERING AND SPRAY FLUXER USING SELECTIVE SOLDERING PALLET

机译:使用选择性焊接托盘进行SAC 305无铅波峰焊接和喷涂助流器的DOE优化

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Wave soldering, for the first time, a SAC 305 Lead-Free Alloy on a 12 layer, 0.092 inches thick board using a selective soldering pallet is no simple task. When switching from lead-tin eutectic wave soldering to lead-free wave soldering a good way to gain understanding of the process and process window is to perform a detailed Design of Experiment of the process parameters. This paper will detail the steps required to optimize the wave soldering process for lead-free wave soldering. Two statistically designed experiments were used for the optimization experiment. A Hardin-Sloane I-Optimal 4 factor matrix was used for the wave soldering factors using 18 trials [6]. A Hardin-Sloane I-Optimal 3 factor matrix using 13 trials was used to optimize the spray fluxer settings [6]. This paper will show how to utilize DOE techniques to achieve the optimal process window with minimal trials, cost and time for lead- free wave soldering. This paper will cover the response outputs of PTH solder hole fill and wetting showing cross- section results of both trials representing “bad” and “good” points in the matrix. This study generated very unique PTH solder voiding phenomena and will be studied using the DOE model and discussed. The sweet-spot optimum for the response factors will be shown demonstrating the power of DOE process optimization.
机译:波峰焊接,首次在12层上的囊305无铅合金,使用选择性焊接托盘的0.092英寸厚的板是没有简单的任务。当从引导锡共晶波焊接到无铅波焊接时,获得对过程的理解和过程窗口的好方法是执行工艺参数的实验的详细设计。本文将详细介绍优化无铅波焊波焊接过程所需的步骤。两个统计设计的实验用于优化实验。使用18试验的波硅纤维I-最佳4因子基质用于波焊剂[6]。使用13试验的Handin-Sloane I-Optimal 3因子矩阵优化喷雾助流器设置[6]。本文将展示如何利用DOE技术实现具有最小试验,成本和时间的最佳过程窗口,可实现无铅波峰焊接。本文将涵盖第P焊洞填充和润湿的响应输出,显示两种试验的横截面结果,代表矩阵中的“坏”和“良好”点。这项研究产生了非常独特的第p焊料空缺现象,并将使用DOE模型进行研究并讨论。将显示响应因子的甜点最佳,证明了DOE过程优化的力量。

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