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首页> 外文期刊>Journal of Materials Engineering and Performance >Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy
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Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

机译：PCB基板表面光洁度和助焊剂对无铅SAC305合金可焊性的影响

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摘要

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260℃ on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t_0 and the contact angle θ. The shortest wetting time was noted for the OSP finish (t_0 = 0.6 s with EF2202 flux and t_0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t_0 = 1.36 s with EF2202 flux and t_0 = 1.55 s with RF800 flux). The θ values calculated from the wetting balance tests were as follows: the lowest θ of 45° was formed on HASL LF (EF2202 flux), the highest θ of 63° was noted on the OSP finish, while on the ENIG finish, it was 58° (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
机译：使用润湿平衡法检查了SAC305合金与具有不同表面光洁度的印刷电路板（PCB）接触的可焊性。这项研究是在温度为260℃的三种类型的PCB上进行的，这些PCB覆盖有（1）热风焊料整平（HASL LF），（2）化学镀镍沉金（ENIG）和（3）有机表面保护剂（OSP） ，有机表面处理，均在Cu基板上和两种类型的助焊剂（EF2202和RF800）上进行。结果表明，PCB基板的表面光洁度对润湿时间t_0和接触角θ的值都有很大的影响。 OSP涂层的润湿时间最短（EF2202助熔剂为t_0 = 0.6 s，RF800助熔剂为t_0 = 0.98 s），而ENIG涂层显示出最长的润湿时间（EF2202助熔剂为t_0 = 1.36 s，t_0 = 1.55 s使用RF800助焊剂）。根据润湿平衡测试计算得出的θ值如下：在HASL LF（EF2202助熔剂）上形成的最低θ为45°，在OSP涂层上的最高θ为63°，而在ENIG涂层上为58°（EF2202助焊剂）。在可焊性测试之后，通过扫描电子显微镜结合能量色散光谱法对横截面样品进行界面表征。

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