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首页> 外文期刊>Soldering & Surface Mount Technology >Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective soldering
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Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective soldering

机译：助焊剂性能对选择性焊接无铅焊点质量和微观结构的影响

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Purpose - The purpose of this paper is to investigate the influence of the properties of new compositions of fluxes for selective soldering on lead-free solder joints quality and microstructures as well as showing which flux properties are the most important. Design/methodology/approach - The three different types of fluxes were tested, which differed in composition, solids content, amount and type of activators added. The selective soldering process was done with the use of lead-free solder SAC 305. The test boards had two coatings SnCu (HASL) or Au/Ni. Basic chemical and physical properties of fluxes were examined according to the relevant standards. Different types of components from the bulky ones, demanding more heat, to the smaller ones were used during the assembly process. AOI and X-ray analyses as well as cross-sections and SEM analyses were utilized to deeply assess the quality and microstructure of the investigated solder joints. Findings - The results showed that information about density or static activity of flux is not enough for correct flux assessment. The dynamic activity of flux measured by wetting balance method is the best for this, especially in the case when there is short soldering time and heat transfer is hindered. The quality and the microstructure of lead-free solder joints are related not only with wetting properties of the flux used for soldering but also with other properties like solids content in a flux. Research limitations/implications - It is suggested that further studies are necessary for the confirmation of the practical application, especially of the reliability properties of the joints obtained with the use of the elaborated fluxes. Originality/value - The results showed that type of flux (ORL or ROL) as well as minor changes in their dynamic activity and solids content might have significant influence on quality of solder joints and their microstructure. It was noted that selective soldering is demanding technique and optimization of soldering process for different type of components and fluxes is important.
机译：目的-本文的目的是研究用于选择性焊接的新型焊剂成分对无铅焊点质量和微结构的影响，并说明哪种焊剂性能最重要。设计/方法/方法-测试了三种不同类型的助焊剂，它们的成分，固体含量，添加的活化剂的数量和类型都不同。选择性焊接过程是使用无铅焊料SAC 305完成的。测试板具有两个镀层SnCu（HASL）或Au / Ni。根据相关标准检查了助焊剂的基本化学和物理性能。在组装过程中，使用了不同类型的组件，从需要更多热量的笨重组件到较小组件。 AOI和X射线分析以及横截面和SEM分析被用来深入评估所研究焊点的质量和微观结构。发现-结果表明，有关焊剂密度或静态活性的信息不足以进行正确的焊剂评估。为此，通过湿平衡法测量的助焊剂的动态活性是最好的，特别是在焊接时间短且阻碍传热的情况下。无铅焊点的质量和微观结构不仅与用于焊接的助焊剂的润湿特性有关，而且与其他特性（例如焊剂中的固体含量）有关。研究的局限性/意义-建议进一步的研究对于确认实际应用是必要的，尤其是对于使用精细焊剂获得的接头的可靠性特性。原创性/价值-结果表明，助焊剂的类型（ORL或ROL）以及其动态活性和固体含量的细微变化可能会对焊点的质量及其微观结构产生重大影响。值得注意的是，选择性焊接是一项苛刻的技术，针对不同类型的元件和助焊剂，优化焊接工艺非常重要。

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