LOW TEMPERATURE ANODIC BONDING OF A SUB-μ FABRY-PEROT CAVITY

机译：亚μ裂纹-珀罗腔的低温阳极键合

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A cavity in silicon with an extreme height to width ratio of 1:1600 (300 nm deep and 500μm wide) has been anodically bonded to Pyrex (Corning #7740). A straightforward optical inspection shows that the membrane neither stick to the silicon bottom of the cavity, nor buckle. Attached to the end of an optical fiber this device will be used as an optical pressure sensor. The standard anodic bonding procedure of applying the voltage after the temperature has stabilized was not efficient. Instead a procedure of ramping temperature to process value with the voltage applied is used.

机译：硅中的一个空腔的高度与宽度之比为1：1600（深300 nm，宽500μm）已阳极键合至Pyrex（Corning＃7740）。直观的光学检查表明，该膜既不粘附在腔体的硅底部，也不弯曲。连接到光纤末端的此设备将用作光学压力传感器。在温度稳定后施加电压的标准阳极键合程序效率不高。取而代之的是使用随施加的电压使温度升高至过程值的过程。

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来源
《Fifth International Symposium on Semiconductor Wafer Bonding, 5th, Oct 1999, Honolulu》|1999年|p.429-437|共9页
会议地点 Honolulu HI(US)
作者
Ase Richard; Kjell Sundin; Ylva Baecklund;
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作者单位

Solid State Electronics, The Angstroem Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden;

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原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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LOW TEMPERATURE ANODIC BONDING OF A SUB-μ FABRY-PEROT CAVITY

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