Sch. of Eng. Inf. Technol., Univ. Malaysia Sabah, Kota Kinabalu, Malaysia;
Ge-Si alloys; MOSFET; impact ionisation; low-power electronics; semiconductor device breakdown; SiGe; breakdown voltage; drain current; dual channel vertical strained impact ionization MOSFET; low power nanoelectronics device; voltage 1.6 V; voltage 2 V; voltage 2.5 V; voltage 2.9 V; Germanium; Impact ionization; MOSFET; Performance evaluation; Photonic band gap; Silicon; Silicon germanium; Strained SiGe; Vertical Strained SiGe Impact Ionization MOSFET (VESIMOS); band gap; breakdown voltage;
机译:采用双通道垂直应变SIGE冲击电离MOSFET(VESIMOS)的击穿电压降低分析
机译:掺入电介质袋(VESIMOS-DP)的垂直应变直击式电离MOSFET的掺杂浓度分析
机译:基于基于生物传感器应用的垂直应变撞击电离MOSFET(VESIMOS)技术方法使用其行为模型
机译:垂直应变的SiGe碰撞电离MOSFET(VESIMOS)的单应变和双应变通道分析
机译:硅锗/硅垂直MOSFET和侧壁应变硅器件:设计和制造。
机译:有序SiGe点上的应变MOSFET
机译:掺杂浓度分析垂直应变-SiGe碰撞电离MOSFET介电袋(VESIMOS-DP)的性能分析