Design Challenges in Power Semiconductor Modules for Hybrid Electric Vehicle Applications

机译：混合动力汽车应用中功率半导体模块的设计挑战

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The recent emergence of the Hybrid Electric Vehicle (HEV) is driving new growth opportunities in the power semiconductor market. Industrial motor drive customers are the prime users of high power semiconductor modules to date. However, power module requirements for HEV are quite different from the industrial market. The performance demand combined with high power density, enhanced reliability and low cost requirements from the automotive OEMs are pushing the device and module suppliers to bring new technology to meet all these demands. In this paper, the design challenges of an automotive module for HEV will be discussed from the performance, reliability and cost perspective.

机译：混合动力汽车（HEV）的最新出现为功率半导体市场带来了新的增长机会。迄今为止，工业电机驱动器客户是高功率半导体模块的主要用户。但是，HEV的电源模块要求与工业市场完全不同。汽车OEM厂商对性能的要求与高功率密度，增强的可靠性和低成本的要求相结合，正推动设备和模块供应商提供新技术来满足所有这些要求。在本文中，将从性能，可靠性和成本的角度讨论用于HEV的汽车模块的设计挑战。

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来源
《Global Powertrain Congress on Advanced Propulsion amp; Emission vol.38; 20060919-21; Novi,MI(US)》|2006年|20-25|共6页
会议地点 NoviMI(US)
作者
Sayeed Ahmed; Markus Thoben; Mark Muenzer;
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Infineon;

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原文格式 PDF
正文语种 eng
中图分类电力机车;
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Design Challenges in Power Semiconductor Modules for Hybrid Electric Vehicle Applications

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