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首页> 外文会议>High-Power Laser Ablation VI pt.1 >High speed laser cutting of micro structures with submicron details
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High speed laser cutting of micro structures with submicron details

机译：高速激光切割具有亚微米级细节的微结构

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摘要

The demand on performance for displays and opto-electronics is ever increasing and the industry is looking for ways to produce large area microoptical films to help that cause. While conventional techniques are reaching their limits for large area structuring, earlier reports show that it is possible to structure a few m~2 polymer film with microoptical features (> 20 μm) by direct laser ablation. By employing the same optics and hardware studies were carried out to find the minimal feature size possible without compromising the area that can be processed. Looking at the sub-resolution ablation behaviour of Polycarbonate enables us to modify the so-called Synchronised Image Scanning (SIS) mask design to control shape and form of 3D-features only a few times bigger than the resolution limit of the laser ablation mask projection system. Results of optical 10 μm and 5 μm features are shown and discussed. The findings show that it is realistic to direct laser cut well defined optical 3D-features into polymer film with an unprecedented feature-area-ratio in excess of 1:10~(10).
机译：对显示器和光电性能的需求不断增长，业界正在寻找生产大面积微光学膜的方法来解决这一问题。尽管常规技术已经达到了大面积结构化的极限，但较早的报告表明，可以通过直接激光烧蚀来构造具有微光学特征（> 20μm）的几m-2聚合物膜。通过使用相同的光学器件和硬件，进行了研究，以找到可能的最小特征尺寸，而不影响可处理的面积。通过查看聚碳酸酯的亚分辨率消融行为，我们可以修改所谓的同步图像扫描（SIS）掩模设计，以控制3D功能的形状和形式，其尺寸仅比激光消融掩模投影的分辨率极限大几倍。系统。显示并讨论了10μm和5μm光学特征的结果。研究结果表明，将激光切割清晰的光学3D特征引导到聚合物膜中具有前所未有的特征面积比超过1：10〜（10）是现实的。

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