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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Flexible Interconnect and Packaging for MEMS Moveable Neural Microelectrodes
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Flexible Interconnect and Packaging for MEMS Moveable Neural Microelectrodes

机译：MEMS可移动神经微电极的灵活互连和封装

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Interconnect integrity and packaging of implantable microdevices are crucial for their longevity. MEMS devices involving microactuators have special packaging challenges because of moveable parts that can fail if any debris gets trapped in the chip. Additional challenges arise when interfacing such devices with biological tissue. The device presented here is the first MEMS device with electrodes extending off the edge of the chip that are implanted in the brain to monitor neuronal activity. The devices are fabricated using Sandia's SUMMIT-V process, and use thermal actuators to move highly doped polysilicon electrodes bi-directionally. This research presents a MEMS Microflex Interconnect (MMFI) technology approach that uses polyimide (PI-2611) as the Hex circuit. Gold stud bumps are used to "rivet" bond the flexible circuit to the bond pads on the MEMS device. In our approach, we use dual stud bumps in order to allow sufficient room for the actuators and other mechanical structures to move without hindrance. The gold-to-gold bonding eliminates intermetallic formation and gives acceptable strength without the need of an underfill. A backside dry etch is performed on the flexible circuit in order to create micro-channel openings for the moveable electrodes to extend off of the chip. Reliability testing including 85%/85℃, high temperature, thermal cycling, and thermal shock are presented using the MMFI approach. Humidity testing has shown a slight increase in contact resistance from 5.84±0.19 mΩ to 6.00±0.18 mΩ after 500hrs at 85%/85℃. High temperature (300℃) has shown significant increase 6.4±0.45 mΩ to 59.97±38.94 mΩ after 250hrs.This approach offers a lightweight, flexible, biocompatible package, which can be batch fabricated, allowing SMD to be easily bonded and the connector to be mechanically isolated from stresses. MMFI technologies can be a viable approach to package any MEMS device that interfaces with biological systems. In addition, it readily allows for scaling up to high-density devices and systems.
机译：植入式微型设备的互连完整性和包装对于它们的寿命至关重要。涉及微致动器的MEMS器件在封装方面面临特殊挑战，因为可移动部件可能会在碎片中残留任何碎片而导致失效。当将这样的设备与生物组织连接时，还会出现其他挑战。这里介绍的设备是第一个MEMS设备，其电极从芯片边缘伸出，并植入大脑中以监测神经元活动。这些设备使用桑迪亚（Sandia）的SUMMIT-V工艺制造，并使用热致动器双向移动高掺杂多晶硅电极。本研究提出了一种采用聚酰亚胺（PI-2611）作为十六进制电路的MEMS Microflex互连（MMFI）技术方法。金柱形凸块用于将柔性电路“铆接”到MEMS器件的焊盘上。在我们的方法中，我们使用双柱形凸块，以便为执行器和其他机械结构留出足够的空间而不受阻碍地移动。金金结合消除了金属间的形成，并提供了可接受的强度，而无需底部填充。在柔性电路上执行背面干法蚀刻，以便为可移动电极创建微通道开口以延伸出芯片。使用MMFI方法进行了包括85％/ 85℃，高温，热循环和热冲击的可靠性测试。湿度测试表明，在85％/ 85℃下经过500小时后，接触电阻从5.84±0.19mΩ略微增加到6.00±0.18mΩ。 250小时后，高温（300℃）表现出明显的增加6.4±0.45mΩ，至59.97±38.94mΩ。这种方法提供了一种轻巧，灵活，生物相容的封装，可以分批制造，从而使SMD易于粘接并且可以连接连接器与压力机械隔离。 MMFI技术可能是一种可行的方法来封装与生物系统接口的任何MEMS器件。此外，它很容易扩展到高密度设备和系统。

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