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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Gold Wire for Room Temperature Wedge-Wedge Bonding
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Gold Wire for Room Temperature Wedge-Wedge Bonding

机译：室温楔形-楔形结合用金线

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摘要

In recent years room temperature bonding of gold wires has been investigated several times [1]-[3]. A great deal of work has been done and published concerning room temperature ball-wedge bonding [3]-[6].rnOur investigations are focused on wedge-wedge bonding at room temperature using gold wire. Several doped and alloyed gold wires have been bonded on LTCC substrates and stored at high temperature for 2000 hours. Only for comparison, standard AlSil bonding wire and an experimental wire have been included in the experiments.rnWe compared the pull forces for the selected, wire bonded at room temperature (RT) with the pull forces obtained at 135 ℃ bonding temperature.rnThe results suggest that one of the investigated gold wires is well suited for room temperature bonding on gold metalized LTCC.rnRoom temperature wire bonding using gold wire has a remarkable application potential. The promising results will be supplemented with additional studies.
机译：近年来，对金线的室温键合进行了数次研究[1]-[3]。关于室温球形楔焊[3]-[6]，已经完成了大量工作并发表。我们的研究集中在室温下使用金线的楔形楔焊。几根掺杂的合金金线已经粘结在LTCC基板上，并在高温下存储了2000小时。仅作比较，实验中包括了标准的AlSil焊线和实验焊线。rn我们将所选的室温（RT）焊线的拉力与135℃焊点温度下的拉力进行了比较。rn结果表明研究中的一种金线非常适合在金金属化LTCC上进行室温键合。使用金线的室温线键合具有巨大的应用潜力。有希望的结果将通过其他研究得到补充。

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