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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Thermosonic Gold Stud Bump Attach for Large ICs on Laminate Substrates
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Thermosonic Gold Stud Bump Attach for Large ICs on Laminate Substrates

机译：用于层压基板上大型IC的Thermosonic金钉凸块连接

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摘要

Miniaturization and reliability are the two most critical aspects when designing packaging for an implantable electronic medical device. As sizes of implantable devices shrink, more mature packaging methods such as wire bonding become less feasible due to the additional layout area that is required. A flip chip package that employs gold stud bump interconnects is a proven alternative to both chip/wire assembly and flip chips that rely on wafer-level bump redistribution. Gold stud bumping offers several advantages over wafer-level bumping, such as increased flexibility and cost-effectiveness for prototype and small run environments.rnThis assembly methodology consists of three primary steps:rn1) Bumping of the silicon IC using commonly available wire bonding equipmentrn2) Connecting the bumped IC directly to the substrate by thermosonic Au-Au bondingrn3) Dispensing of an underfill material for environmental protection and mechanical stabilityrnThis type of interconnect is common for small devices with low I/O counts, but newer models of flip chip placement equipment are pushing the longstanding limitations of this process. This paper discusses the development and testing of a thermosonic gold stud bump attach process for a large silicon IC (7.5 × 11 mm with 102 I/Os) to an organic laminate PCB.
机译：在设计可植入电子医疗设备的包装时，小型化和可靠性是两个最关键的方面。随着可植入装置尺寸的缩小，由于需要额外的布局区域，更成熟的封装方法（如引线键合）变得不太可行。采用金柱形凸点互连的倒装芯片封装已被证明是依靠晶片级凸点重新分布的芯片/导线组件和倒装芯片的一种可靠替代方案。金制凸块凸点提供了比晶圆级凸点更多的优势，例如增加了原型和小型运行环境的灵活性和成本效益。rn这种组装方法包括三个主要步骤：rn1）使用常用的引线键合设备对硅IC进行凸点rn2）通过热超声Au-Au粘合将凸点IC直接连接到基板rn3）分配底部填充材料以实现环境保护和机械稳定性rn这种类型的互连对于I / O数量少的小型设备是常见的，但是较新的倒装芯片放置设备模型是推动这一过程的长期局限性。本文讨论了将大型硅IC（7.5×11 mm，102个I / O）与有机层压板的热超声金螺柱凸点连接工艺的开发和测试。

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