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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Thermosonic gold wire bonding to laminate substrates with palladium surface finishes
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Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

机译：热超声金线键合至具有钯表面处理的层压基板

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摘要

As the laminate substrate industry moves from hot air solder level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium, and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlayer, were evaluated from two vendors. In each case, a thin gold passivation layer was deposited by immersion plating over the palladium. The initial evaluation criteria included bondability (number of missed bonds and flame off errors), wire pull strength, standard deviation, bond failure mode, and visual inspection. The bonding window was determined by independently varying force (four levels), power (four levels), and time (two levels). The stage temperature was maintained at 150/spl deg/C, compatible with BT laminate material. Different preconditioning environments such as a solder reflow cycle, high temperature storage (125/spl deg/C) and humidity storage (85%RH/85/spl deg/C) on initial bondability were also considered. Rutherford backscattering and Auger analysis were used to examine the surface finishes. The stability of the bonds was investigated by high temperature storage (125/spl deg/C) with periodic electrical resistance and pull strength testing.
机译：随着层压基板行业从热风焊料水平（HASL）饰面转变，人们提出了替代的电镀饰面，例如浸金/化学镍，化学钯和化学银。本文介绍了化学镀钯热超声金球线可焊性的评估结果。由两家供应商评估了两种厚度的钯，有无镍底层。在每种情况下，通过在钯上浸镀来沉积薄的金钝化层。初始评估标准包括可焊性（漏焊的数量和熄火错误），拉线强度，标准偏差，焊缝失效模式以及外观检查。通过独立地改变力（四个级别），功率（四个级别）和时间（两个级别）来确定粘合窗口。平台温度保持在150 / spl deg / C，与BT层压材料兼容。还考虑了不同的预处理环境，例如焊料回流周期，高温存储（125 / spl deg / C）和湿度存储（85％RH / 85 / spl deg / C）的初始粘合性。卢瑟福反向散射和俄歇分析用于检查表面光洁度。通过高温存储（125 / spl deg / C），定期的电阻和抗拉强度测试研究了键的稳定性。

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