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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Materials and Process Selection for High Frequency Flip Chip
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Materials and Process Selection for High Frequency Flip Chip

机译：高频倒装芯片的材料和工艺选择

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Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production.rnThree groups of experiments are reported. The first experiments are on stud bumping thin film substrates for subsequent flip chip bonding. The wire was 17-μm diameter Au1Pd and bumping was uniform and successful, after some initial equipment problems. The second is a set of tests on flip chip bonding using gold stud bumps, gold tin solder-on-substrate, and plated gold pillars on alumina carriers. To evaluate the joining process using these different bumps, chips made of alumina with coplanar waveguide transmission lines were thermocompression bonded to the bumped carriers. Bonder parameters were assessed related to the different bump types and materials. The bonding results were analyzed using shear tests, transmissive x-ray and scanning electron microscopy on cross-sections. The third experiment lot contains early results on reliability of stud bump flip chip of gallium arsenide microstrip chips. Since the sample availability was very low and the joining process still under development, the results are indeterminate, although it was fruitful to establish adequate methods of analysis and test.
机译：自几十年来，倒装芯片一直是高性能电路芯片互连的主要选择。在过去的几年中，对微波领域的兴趣增加了，此时，微波倒装芯片是批量生产的一种可能选择。报告了三组实验。最初的实验是在柱形凸块薄膜基板上进行后续倒装芯片接合。在一些初始设备出现问题之后，焊丝的直径为17μm的Au1Pd，并且隆起均匀且成功。第二个是使用倒装芯片键合的一组测试，该测试使用金柱形凸块，基板上的金锡焊料和氧化铝载体上的镀金柱。为了评估使用这些不同凸块的连接过程，将氧化铝制成的芯片与共面波导传输线热压粘合到凸块载体上。评估了与不同凸块类型和材料相关的键合机参数。使用剪切试验，透射X射线和扫描电子显微镜在横截面上分析结合结果。第三批实验包含砷化镓微带芯片的柱形凸块倒装芯片可靠性的早期结果。由于样品的可用性非常低，并且加入过程仍在开发中，因此尽管可以建立足够的分析和测试方法，但结果尚不确定。

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