• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>IMAPS 40th international symposium on microelectronics >Unwanted Coupling in Millimeter-Wave Multilayer Circuits
【24h】

Unwanted Coupling in Millimeter-Wave Multilayer Circuits

机译：毫米波多层电路中的有害耦合

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

New data are presented on the effects of coupling between conductors in highly integrated,multilayer circuits working at frequencies up to 100 GHz. Whilst multilayer circuits offer many advantages for the microwave circuit designer,unwanted coupling due to dense integration may detract from the electrical performance of the multilayer package. Using a combination of electromagnetic simulation and practical measurement we have established criteria for the optimum spacing of conductors in multilayer ceramic packages. The work was based around the use of photoimageable thick-film conductors and dielectrics,the dielectric had a relative permittivity of 3.9 and the conductors were silver. rnTwo situations were considered in detail,firstly the effect of the crossover of conductors separated by dielectric,and secondly the effect of coupling between parallel conductors on different layers. Both of these geometries were modeled using an electromagnetic simulator (CST – Microwave Studio~R),and the results of simulation were confirmed by practical measurement. The practical circuits were fabricated on alumina,with the crossover and coupled lines built up with successive layers of photoimageable thick-film paste. rnUsing the experimental data,general design graphs have been developed to summarize the results and provide guidance to the circuit designer on the minimum spacing between conductors in a multilayer package.
机译：在工作频率高达100 GHz的高度集成的多层电路中，给出了有关导体之间耦合耦合影响的新数据。尽管多层电路为微波电路设计人员提供了许多优势，但由于密集集成而导致的不必要耦合可能会损害多层封装的电气性能。通过结合电磁仿真和实际测量，我们建立了多层陶瓷封装中导体最佳间距的标准。该工作基于使用可光成像的厚膜导体和电介质，该电介质的相对介电常数为3.9，导体为银。 rn详细考虑了两种情况，首先是被电介质分开的导体交叉的影响，其次是在不同层上的平行导体之间的耦合作用。这两种几何形状均使用电磁模拟器（CST – Microwave Studio〜R）建模，并且通过实际测量证实了仿真结果。实际电路是在氧化铝上制造的，交叉线和耦合线由连续的可光成像的厚膜浆料层构成。使用实验数据，已开发出通用设计图以总结结果，并为电路设计人员提供有关多层封装中导体之间最小间距的指导。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号