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Reliability of μPILR™ Packages under Shock Loading

机译：μPILR™封装在冲击载荷下的可靠性

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Portable consumer electronics is a critical market segment for modern electronics devices which includes lightweight systems such as cell phone,laptop computer,PDA,etc. Due to an ever increasing demand for integration of higher functionality,miniaturization is a parallel ongoing trend for design of microelectronics packages used in such devices. One of the resulting challenges is maintaining or improving reliability of second level interconnects for these packages with respect to mechanical and thermomechanical loading. Board-level drop or impact response of a surface mounted package assembly is an increasingly important facet of the reliability evaluation for application in hand-held or mobile electronics for obvious reasons.rn Rupture of L2 interconnects (solder joints) and test board pad/trace failures are the most commonly observed modes of failure due to shock loading conditions. Various design and test parameters such as materials,geometry and loading configuration affect the failure mechanism involved. This paper presents JEDEC standard JESD22-B111 compliant drop testing results for a new interconnect platform– a novel design using miniature copper contacts (μPILR™). An independent numerical (Explicit Dynamic Finite Element Analysis) study is performed to examine μPILR™ design as well as comparable BGA (Ball Grid Array) design for their response to shock loading conditions at level 2 (L2) interconnects. The μPILR™ design is intended for higher adaptability to increasing I/O density and improvised test/burn-in capabilities. rnDrop testing is performed according to JEDEC board level shock testing standard JESD22-B111 for 0.4 mm,0.5 mm,0.65 mm pitch μPILR™ test vehicles. Finite Element Analysis was conducted to study 0.5 mm pitch μPILR™ and BGA designs.
机译：便携式消费电子产品是现代电子设备的重要市场领域，其中包括手机，笔记本电脑，PDA等轻型系统。由于对更高功能集成的不断增长的需求，小型化是设计用于此类设备的微电子封装的并行并行趋势。由此产生的挑战之一是相对于机械和热机械负载，维持或提高这些封装的二级互连的可靠性。表面安装封装组件的板级掉落或冲击响应是可靠性评估中越来越重要的一个方面，这显然适用于手持或移动电子产品。rn L2互连（焊点）和测试板焊盘/走线的破裂故障是由于冲击载荷条件引起的最常见的故障模式。各种设计和测试参数（例如材料，几何形状和加载配置）会影响所涉及的失效机制。本文介绍了针对新互连平台的JEDEC标准JESD22-B111跌落测试结果-一种使用微型铜触点（μPILR™）的新颖设计。进行了独立的数值（显式动态有限元分析）研究，以检查μPILR™设计以及可比较的BGA（球栅阵列）设计对2级（L2）互连的冲击载荷条件的响应。 μPILR™设计旨在提高适应性，以提高I / O密度和简易的测试/老化功能。 rn跌落测试是根据JEDEC板级冲击测试标准JESD22-B111对0.4 mm，0.5 mm，0.65 mm间距μPILR™测试车辆进行的。进行了有限元分析，以研究0.5 mm间距的μPILR™和BGA设计。

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