Zn-Sn and Zn-In High Temperature Lead-Free Solders

著录项

• 来源
  《IMAPS 40th international symposium on microelectronics》|2007年|p.1-5|共5页
• 会议地点 San Jose CA(US)
• 作者

  K. Suganuma; S.-J. Kim; J.-E. Lee; K.-S. Kim;

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• 作者单位

  ISIR, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan Phone:+81-6-6879-8520, FAX:+81-6-6879-8522, e-mail: suganuma@sanken.osaka-u.ac.jp;

  ISIR, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan Phone:+81-6-6879-8520, FAX:+81-6-6879-8522;

  ISIR, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan Phone:+81-6-6879-8520, FAX:+81-6-6879-8522;

  ISIR, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan Phone:+81-6-6879-8520, FAX:+81-6-6879-8522;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词

  high temperature solder; lead-free; Zn-Sn; microstructure; ductility; die attach; Scheil’s model;

  机译：高温焊料无铅锌锡微观结构延展性死掉席尔的模型;