In the field of wireless broadband communication terrestrial Point-to-Point and Point-to- Multipoint systems are demanded by the market for the transmission of data at a rate of several hundred Mbits per second. This demand in the telecommunications infrastructure industry forces innovative packaging solutions. Frequency bands up to 50 GHz and above and increasing power dissipation makes thermal management to one of the key technologies. Al/SiC, a metal matrix composite material, meets with ist tailored coefficient of thermal expansion (CTE), low weight and high thermal conductivity these general requirements on the electronic packaging of such systems. Eiectrovac, an European manufacturer of hermetic packages as well as power electronic cooling materials as Al/SiC and DBC substrates, developed now a complete set of processes especially for the extraordinary high requirements on telecom packages.
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机译：在无线宽带通信领域中，市场要求以每秒几百兆位的速率传输数据的地面对点和点对多点系统。电信基础设施行业的这种需求迫使创新包装解决方案。高达50 GHz及以上的频带以及不断增加的功耗使热管理成为关键技术之一。 Al / SiC是一种金属基复合材料，符合其定制的热膨胀系数（CTE），重量轻和导热率高等这些系统电子封装的一般要求。欧洲密封包装以及电力电子冷却材料（如Al / SiC和DBC基板）的欧洲制造商Eiectrovac现在开发了一套完整的工艺，尤其是对电信包装的非凡要求。
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