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High-performance interferometer for site flatness inspection

机译：用于现场平面度检查的高性能干涉仪

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Abstract: The semiconductor industry is continually moving towards more complex processor designs. The new chips occupy bigger areas and surface properties of silicon wafers used in manufacturing, such as PV and RMS, become critical. One of most important characteristics of wafers is their site flatness, defined as height parameters over area occupied by the projected semiconductor chip. Smaller critical dimensions, shorter wavelength, and higher numerical aperture steppers impose more stringent requirements on PV and RMS of the site's profile. As the wafer goes through the manufacturing process, its value increases, so detecting defective sites is essential to lowering the production costs. To resolve this problem Veeco Process Metrology has designed the RTI 4100 - a high performance laser Fizeau interferometer especially suited for inspection of site wafer flatness. High accuracy data taken y the instrument is analyzed by automated software package that performs evaluation of the user selectable sites and qualifies them using various user defined rejection criteria. In this paper, we present some aspects of the instruments' design and its measurement capabilities with interest to the semiconductor industry.!4
机译：摘要：半导体行业正在不断朝着更复杂的处理器设计发展。新芯片占据了更大的面积，制造中使用的硅晶片的表面特性（例如PV和RMS）变得至关重要。晶片的最重要特征之一是其位置平坦度，其定义为投射半导体芯片所占面积上的高度参数。较小的临界尺寸，较短的波长和较高的数值孔径步进器对现场轮廓的PV和RMS提出了更严格的要求。随着晶圆经过制造过程，其价值会增加，因此检测缺陷位置对于降低生产成本至关重要。为了解决这个问题，Veeco Process Metrology设计了RTI 4100 –高性能激光Fizeau干涉仪，特别适合于检查现场晶片的平整度。仪器获取的高精度数据由自动化软件包进行分析，该软件包对用户可选择的部位进行评估，并使用各种用户定义的拒绝标准对它们进行鉴定。在本文中，我们介绍了半导体行业感兴趣的仪器设计及其测量能力的某些方面。4

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