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Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon

机译:单晶硅超精密车削的脆韧性转变机理研究

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摘要

According to the size effect theory established on the concept of geometrically necessary dislocations and results of nano-indentation experiments, a novel brittle-ductile mechanism of ultra-precision turning of single crystal silicon is proposed. The accurate critical chip thickness is firstly calculated on the basis of theoritical analysis. A macro-micro cutting model is created based on the brittle-ductile transition mechanism. Finally, the results of study are testified through experiments.
机译:根据在几何上必要的位错的概念上建立的尺寸效应理论和纳米压痕实验的结果,提出了一种新的单晶硅超精密车削脆性延展机理。首先根据理论分析计算出精确的临界切屑厚度。基于脆性-延性转变机制创建了宏观-微观切削模型。最后,通过实验证明了研究结果。

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