Solid Hinge Guide Made by Silicon Bulk Microtechnology

机译：硅本体微技术制作的固体铰链指南

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A system of solid hinges was produced by silicon bulk microtechnology which guides a stage inside the chip plane along a straight line. The design has to take into consideration the fracture strength of the silicon structure. Striving for a stroke in the mm-range the dimensions of the whole chip are 40 mm x 28 mm. Using a simple micrometer drive the y- and z-runouts from the straight line in x along 1mm were measured as 2 urn caused by lacks of the driving mechanism.

机译：固体铰链系统是由硅块微技术生产的，该系统沿直线引导芯片平面内部的平台。设计必须考虑硅结构的断裂强度。争取在毫米范围内的行程，整个芯片的尺寸为40毫米x 28毫米。使用简单的千分尺驱动器，由于缺少驱动机构，导致沿x沿1mm的直线的y和z跳动测量为2 urn。

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《International Conference of the European Society for Precision Engineering and Nanotechnology vol.1; 20050508-11; Montpellier(FR)》|2005年|329-332|共4页
会议地点 Montpellier(FR)
作者
J. Fruehauf; E. Gaertner; M. Seifert;
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Chemnitz University of Technology - D-09107 Chemnitz - Germany;

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原文格式 PDF
正文语种 eng
中图分类特种结构材料;
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4. Solid Hinge Guide Made by Silicon Bulk Microtechnology [C] . J. Fruehauf, E. Gaertner, M. Seifert International Conference of the European Society for Precision Engineering and Nanotechnology vol.1; 20050508-11; Montpellier(FR) . 2005

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Solid Hinge Guide Made by Silicon Bulk Microtechnology

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