A High Performance Planar ECF Pump for Liquid Cooling of High Power Electronic Chips

机译：高性能平面ECF泵，用于大功率电子芯片的液体冷却

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This paper presents a novel liquid cooling concept for heat rejection of high power electronic chips existing in notebook computers etc. In order to realize a liquid cooling system for the electronic chips, such as notebook CPUs, a simple planar pump using electro-conjugate fluid (ECF) is proposed, fabricated, and experimentally investigated. The ECF is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF pump has a parallel rod-like electrode array attached on a substrate and generates ECF flows by ECF-jet in each pair of electrodes. The proposed planar ECF pump achieves no-load flow rate of 5.5 cm~3/s and maximum output pressure of 7.1 kPa at an applied voltage of 2.0 kV.

机译：本文提出了一种新颖的液体冷却概念，用于笔记本电脑等中存在的大功率电子芯片的散热。为了实现诸如笔记本电脑CPU之类的电子芯片的液体冷却系统，使用电共轭流体的简单平面泵（ ECF）的提出，制造和实验研究。 ECF是一种介电和功能性流体，它通过通过一对棒状电极施加静电电场来产生射流（ECF射流）。 ECF泵具有附着在基板上的平行杆状电极阵列，并通过ECF喷射在每对电极中产生ECF流。所提出的平面ECF泵在2.0 kV的施加电压下可实现5.5 cm〜3 / s的空载流速和7.1 kPa的最大输出压力。

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来源
《International Conference on Fluid Power Transmission and Control(ICFP' 2005); 20050405-08; Hangzhou(CN)》|2005年|P.2.234-2.237|共4页
会议地点 Hangzhou(CN)
作者
Shinichi YOKOTA; Woo-Suk SEO; Kazuhiro YOSHIDA; Kazuya EDAMURA;
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作者单位

Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503, JAPAN;

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会议组织
原文格式 PDF
正文语种 eng
中图分类液压传动;工程流体力学;
关键词
electro-conjugate fluid (ECF); ECF pump; planar pump; liquid cooling system; electronic chip cooling;

机译：电共轭流体（ECF）; ECF泵;平面泵;液体冷却系统;电子芯片冷却;

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1. Investigation on the Impact on Thermal Performances of New Pin and Fin Geometries Applied to Liquid Cooling of Power Electronics [J] . Matt Reeves, Jesus Moreno, Peter Beucher, International Journal of Microscale and Nanoscale Thermal and Fluid Transport Phenomena . 2012,第3期

机译：用于功率电子液体冷却的新型销形和鳍形几何形状对热性能的影响研究
2. Optimal thermal operation of liquid-cooled electronic chips [J] . Chander Shekhar Sharma, Severin Zimmermann, Manish K. Tiwari, International Journal of Heat and Mass Transfer . 2012,第7a8期

机译：液冷电子芯片的最佳热运行
3. Direct liquid cooling of electronic chips by single-phase forced convection of FC-72 [J] . K.W. Tou, G.P. Xu, C.P. Tso Experimental Heat Transfer . 1998,第2期

机译：通过FC-72的单相强制对流直接对电子芯片进行液体冷却
4. A High Performance Planar ECF Pump for Liquid Cooling of High Power Electronic Chips [C] . . 2005

机译：高性能平面ECF泵，用于大功率电子芯片的液体冷却
5. Design and Optimization of Liquid Cooling Systems Used in High Performance Electronic Packaging [D] . Hadad, Yaser . 2019

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6. A Thermoelectric-Heat-Pump Employed Active Control Strategy for the Dynamic Cooling Ability Distribution of Liquid Cooling System for the Space Station’s Main Power-Cell-Arrays [O] . Hui-Juan Xu, Ji-Xiang Wang, Yun-Ze Li, 2019

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7. A Thin-Planar Pump Using Electro-Conjugate Fluid (ECF) for Liquid Cooling of Electronic Chips [O] . Shinichi YOKOTA, Woo-Suk SEO, Kazuhiro YOSHIDA, 2005

机译：一种薄板泵，使用电轭流体（ECF）进行电子芯片的液体冷却
8. Thermal Enhancement of Silicon Carbide (SiC) Power Electronics and Laser Bars: Statistical Design Optimization of a Liquid-Cooled Power Electronic Heat Sink. [R] . Scofield, J. D. 2015

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A High Performance Planar ECF Pump for Liquid Cooling of High Power Electronic Chips

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