首页> 外文会议>International Conference on Mechanical Engineering and Mechanics vol.1; 20051026-28; Nanjing(CN) >Errors Analysis and Synthesis of Wafer Stages Based on Rigid Body Kinematics
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Errors Analysis and Synthesis of Wafer Stages Based on Rigid Body Kinematics

机译:基于刚体运动学的晶片级误差分析与综合

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Motion accuracy of wafer stage is one crucial factor to determine the critical dimension of integrated circuits in microlithography. A new error model is proposed based on rigid body kinematics. For the macrostage part of the wafer stage, a displacement measurement method is presented to calibrate the errors. By measuring the displacement errors along the 6 lines in the stage work zone, a total of 13 geometric error components in the macrostage can be determined. For the microstage part, the errors mapping relation is derived based on matrix differential method. An error synthesis approach using nonlinear optimization model is put forward based on the sensitivity analysis. Two simulation examples are carried out to illustrate the proposed approaches. The above errors model can present references to the design and analysis of wafer stages.
机译:晶片台的运动精度是确定微光刻中集成电路的关键尺寸的关键因素。提出了一种基于刚体运动学的误差模型。对于晶片台的宏观台部分,提出了一种位移测量方法来校准误差。通过测量平台工作区中沿6条线的位移误差,可以确定宏平台中总共13个几何误差分量。对于微级零件,基于矩阵微分法推导了误差映射关系。在灵敏度分析的基础上,提出了一种利用非线性优化模型的误差综合方法。进行了两个仿真示例来说明所提出的方法。上述误差模型可以为晶圆台的设计和分析提供参考。

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