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首页> 外文会议>International Conference on Nanomaterials by Severe Plastic Deformation(NanoSPD3); 20050922-26; Fukuoka(JP) >Microstructural Evolution in Pure Copper Severely Deformed by the ARB Process
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Microstructural Evolution in Pure Copper Severely Deformed by the ARB Process

机译：ARB工艺严重变形的纯铜的组织演变

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摘要

An oxygen free high conductivity (OFHC) copper (99.99%) was intensely deformed by the accumulative roll-bonding (ARB) process up to equivalent strain of 4.8 at ambient temperature. The microstructure evolution during the ARB process was explained by grain subdivision. The deformed specimens revealed dislocation cell structures at low strain and elongated ultra fine grains separated by high angle boundaries at high strain. The spacing of the high angle lamellar boundary exponentially decreased as a function of strain. The fractions of high angle boundaries (HAB) and the low angle boundaries (LAB) were nearly equal even at strain of 3.2, which was significantly different from the ARB processed Al alloys and ferritic steel where the HAB fraction was above 70% at the same strain. TEM observations indicated a mixed microstructure of dislocation boundaries and cell walls with dislocation tangle at low strain of 1.6, and small recrystallized grains partly appeared above strain of 3.2. As a result, the LAB fraction due to partial recrystallization was high even at strain of 4.8. The occurrence of recrystallization is attributed to high purity of the OFHC copper, the accumulated dislocation density, and the adiabatic heating during the ARB process of one-pass large reduction without lubrication.
机译：无氧高导电率（OFHC）铜（99.99％）通过累积辊压结合（ARB）工艺剧烈变形，在环境温度下的等效应变为4.8。晶粒细化解释了ARB过程中的微观结构演变。变形后的样品在低应变下显示出位错细胞结构，在高应变下显示出细长的超细晶粒被高角度边界隔开。大角度层状边界的间距作为应变的函数呈指数减小。即使在3.2的应变下，高角度边界（HAB）和低角度边界（LAB）的分数也几乎相等，这与ARB处理的铝合金和铁素体钢的HAB分数在同一条件下均高于70％的情况有很大不同应变。 TEM观察表明，在低应变为1.6时，位错边界和晶胞壁混合在一起，具有位错缠结的混合微观结构，并且在3.2应变以上时出现了小的再结晶晶粒。结果，即使在4.8应变下，由于部分重结晶引起的LAB分数也很高。重结晶的发生归因于OFHC铜的高纯度，累积的位错密度以及在不润滑的情况下一次大通量还原的ARB过程中的绝热加热。

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