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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Assessment of microstructural and electrochemical behavior of severely deformed pure copper through equal channel angular pressing
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Assessment of microstructural and electrochemical behavior of severely deformed pure copper through equal channel angular pressing

机译：通过等通道角压进行严重变形纯铜的微观结构和电化学行为的评估

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摘要

In the present research, the passive and electrochemical responses of pure copper, heavily deformed by equal channel angular pressing (ECAP), in a phosphate buffer solution (pH = 10.69) were investigated. For this purpose, various electrochemical tests such as potentiodynamic polarization (PDP), electrochemical impedance spectroscopy (EIS), and Mott-Schottky (M-S) analysis were carried out. Also, the influences of ECAP on distribution of the plastic strain and maximum principal stress were analyzed using a three-dimensional (3D) simulation by finite element methods (FEM). According to the field emission scanning electron microscope (FESEM) micrograph, by increasing the ECAP passes, finer microstructure was obtained. Considering all the electrochemical tests results, it can be concluded that the passive and electrochemical responses of pure copper are improved under influence of ECAP process, mainly due to the formation of thicker and less defective passive film. (C) 2017 Elsevier B.V. All rights reserved.
机译：在本研究中，研究了纯铜，在磷酸盐缓冲溶液（pH = 10.69）中，通过相等通道角压（ECAP）严重变形的纯铜的被动和电化学响应。为此目的，进行各种电化学测试，例如电位动力学偏振（PDP），电化学阻抗光谱（EIS）和MOTT-SCHOTTKY（M-S）分析。此外，使用有限元方法（FEM）使用三维（3D）模拟来分析ECAP对塑料应变分布和最大主应力的影响。根据场发射扫描电子显微镜（FESEM）显微镜，通过增加ECAP通过，获得更精细的微观结构。考虑到所有电化学测试结果，可以得出结论，纯铜的被动和电化学反应在ECAP过程的影响下得到改善，主要是由于形成较厚且缺陷的无源膜的形成。 （c）2017年Elsevier B.V.保留所有权利。

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