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Growth and evaluation of GaN with SiN interlayer by MOCVD

机译:具有SiN中间层的GaN的MOCVD生长和评估

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摘要

GaN epilayers grown with introducing a high-temperature SiN interlayer by metalorganic chemical vapour deposition (MOCVD) were investigated by means of XRD, AFM, and TEM. SiN_4 was used as Si source for SiN growth. It was found that by inserting the SiN layer, the subsequently grown GaN layers have a lower threading dislocation density with respect to that in the conventional GaN films. The dislocations were observed to terminate at the SiN/GaN interface, where Si incorporations may occur. It suggests that the quality of the GaN epilayers has been improved by introducing the optimised grown HT-SiN interlayer.
机译:通过XRD,AFM和TEM研究了通过金属有机化学气相沉积(MOCVD)引入高温SiN中间层而生长的GaN外延层。 SiN_4用作SiN生长的Si源。已经发现,通过插入SiN层,随后生长的GaN层具有比常规GaN膜中更低的穿线位错密度。观察到位错终止于可能发生Si结合的SiN / GaN界面。这表明通过引入优化的生长HT-SiN中间层可以改善GaN外延层的质量。

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