首页> 外文会议>International Conference on Nitride Semiconductors(ICNS-5); 20030525-20030530; Nara; JP >Si doping effects on the electrical and structural properties of high Al composition Al_xGa_(1-x)N films grown by MOCVD
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Si doping effects on the electrical and structural properties of high Al composition Al_xGa_(1-x)N films grown by MOCVD

机译:Si掺杂对MOCVD生长的高Al成分Al_xGa_(1-x)N薄膜电学和结构性能的影响

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摘要

We analyzed the electrical and structural properties of 200 nm thick Al_xGa_(1-x)N:Si samples, grown at 1150 ℃ on 1 μm thick Al_(0.62)Ga_(0.38)N-on-sapphire buffer layers. The electrical activity of Si donors was found to decrease with increasing Al composition in the films. A large improvement in the Si electrical activity was achieved on 100 nm thick Al_(0.65)Ga_(0.35)N films grown at 920 ℃ using In-Si codoping. These samples exhibited n-type carrier concentrations as high as n = 2.5 x 10~(19) cm~(-3). High resolution X-ray analysis of Al_(0.49)Ga_(0.51)N films grown at 1150 ℃ with different Si doping levels revealed that Si doping promoted the strain relaxation of the Al_(0.49)Ga_(0.51)N films with respect to the buffer layers. Si doping also induced increased surface roughness, through pit formation, as evaluated by atomic force microscopy. Transmission electron microscopy images linked the strain relaxation of the Al_(0.49)Ga_(0.51)N layers to the inclination of edge threading dislocations in the film.
机译:我们分析了200 nm厚的Al_xGa_(1-x)N:Si样品的电学和结构特性,该样品在1150m厚的Al_(0.62)Ga_(0.38)N-蓝宝石缓冲层上于1150℃生长。发现Si供体的电活性随着膜中Al组成的增加而降低。使用In-Si共掺杂在920℃下生长的100 nm厚Al_(0.65)Ga_(0.35)N薄膜上,Si的电活性有了很大的提高。这些样品表现出高达n = 2.5 x 10〜(19)cm〜(-3)的n型载流子浓度。高分辨率X射线分析Al_(0.49)Ga_(0.51)N薄膜在1150℃下生长,不同的Si掺杂水平揭示了Si掺杂促进了Al_(0.49)Ga_(0.51)N薄膜的应变弛豫。缓冲层。如原子力显微镜所评估的,硅掺杂还通过凹坑形成而引起表面粗糙度的增加。透射电子显微镜图像将Al_(0.49)Ga_(0.51)N层的应变松弛与薄膜中边缘螺纹位错的倾角联系起来。

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