首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.1 Oct 28-Nov 2, 2001 Tsukuba, Japan >Aluminum Doping of Epitaxial Silicon Carbide Grown by Hot-Wall CVD; Effect of Process Parameters
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Aluminum Doping of Epitaxial Silicon Carbide Grown by Hot-Wall CVD; Effect of Process Parameters

机译:热壁CVD生长外延碳化硅的铝掺杂;工艺参数的影响

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摘要

Intentional p-type doping of SiC has been performed by using trimethylaluminum as dopant source. A comprehensive investigation of the aluminum incorporation dependency on temperature, pressure, C/Si ratio and growth rate in a horizontal hot-wall CVD reactor has been made. The incorporation mechanism for 4H and 6H-SiC both for Si- and C-face material is presented.
机译:通过使用三甲基铝作为掺杂剂源,进行了有意的SiC的p型掺杂。对水平热壁CVD反应器中铝的掺入对温度,压力,C / Si比和生长速率的依赖性进行了全面研究。提出了用于Si和C面材料的4H和6H-SiC结合机理。

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