• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International conference on soldering amp; reliability >EFFECT OF SILVER IN COMMON LEAD-FREE ALLOYS
【24h】

EFFECT OF SILVER IN COMMON LEAD-FREE ALLOYS

机译：银在普通无铅合金中的作用

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Silver bearing alloys have been used in electronics solderingrnfor many years. Silver has been used in tin-lead soldersrn(Sn62Pb36Ag2) to combat silver scavenging from silverrnplated electronic components as well as to improve thermalrnfatigue resistance. Many of the common lead-free alloysrncontain some amount of silver. Silver bearing alloys haverngood electrical and thermal conductivity as well as thernability to wet to the common surface finishes used in printedrnwiring assemblies, thus giving it all the attributes needed forrnan electronic solder alloy. Presence of silver in Sn basedrnsolders increases the bulk solder modulus and is generallyrnbelieved to improve resistance to fatigue from thermalrncycles. Increased solder modulus can be advantageous orrndisadvantageous depending on the desired performancernattribute. For example in high strain rate situations, higherrnmodulus of the bulk solders results in lower life time.rnA wide variety of leaded and lead-free solders containingrndifferent levels of silver has been studied and is in use inrnelectronics industry for a wide range of applications rightrnnow. Studies specific to application process, orrnperformance attributes have been conducted and reported inrntechnical and commercial publications. At CooksonrnElectronics we have investigated a whole range of solderrnalloys containing various levels of silver for various reasonsrnand for a variety of applications. There is need in thernindustry to understand the effects of silver presence inrnsolders from various applications perspective. This articlernwill attempt to present a review of the key published resultsrnon the silver containing alloys along with results of ourrninternal studies on wave soldering, surface mount andrnBGA/CSP applications. Advantages and disadvantages ofrnsilver at different levels will be discussed. Specifically thisrnreport will focus on the effect of silver on processrnconditions, drop shock resistance, solder joint survivabilityrnin high strain rate situations, thermal fatigue resistance, Curndissolution and effects of silver in combination with otherrnalloy additives. Specific application problems demandingrnhigh silver level and other requiring silver level to thernminimum will be discussed.
机译：含银合金已经在电子焊接中使用了很多年。银已被用于锡铅焊料（Sn62Pb36Ag2）中，以消除镀银电子元件中的银清除作用，并提高耐热疲劳性。许多常见的无铅合金包含一定量的银。含银合金具有良好的电导率和导热性，以及对印刷线路组件中所用的普通表面光洁度的润湿性，因此赋予了其电子焊料合金所需的所有属性。锡基焊料中银的存在会增加整体焊料模量，并且通常被认为可以提高抗热循环疲劳性。取决于期望的性能属性，增加的焊料模量可以是有利的或不利的。例如，在高应变率的情况下，散装焊料的模量较高会缩短使用寿命。rn研究了各种含银量不同的含铅和无铅焊料，目前已在电子工业中用于各种应用。已经针对应用过程，性能性能进行了专门研究，并在技术和商业出版物中进行了报道。在CooksonrnElectronics，出于各种原因和各种应用，我们研究了包含各种银含量的全系列锡合金。在工业界需要从各种应用的角度了解银存在的焊料的影响。本文将尝试对主要发表的结果进行综述，包括含银合金以及我们内部对波峰焊，表面贴装和BGA / CSP应用的研究结果。将讨论不同级别的银的优缺点。具体而言，该报告将重点关注银对工艺条件，抗跌落冲击性，在高应变率情况下的焊点存活性，抗热疲劳性，Curr溶解性以及银与其他合金添加剂的组合的影响。将讨论要求高银含量和其他要求银含量最小的具体应用问题。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号