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THERMAL CYCLE TESTING OF PWBS – METHODOLOGY

机译:PWBS热循环测试–方法论

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Reliability testing of printed wire boards (PWBs) by thermalrncycling offers an ability to compare relative survivabilityrnthrough assembly and reliability in the end use environment.rnThis article delineates an eleven step method to establish arntest protocol that will maximize accuracy, applicability,rnreduced costs and reduce the propensity for confounded datarnin thermal cycle testing of bare PWBs exposed the lead-freernassembly and rework simulation. The method presented inrnthis paper is targeted to the unique challenges afforded byrnlead-free testing applications, testing the integrity ofrnconductive interconnections and dielectric materials.
机译:通过热循环对印刷线路板(PWB)进行可靠性测试,可以比较最终组装环境中的相对生存性和组装可靠性。本文介绍了一种建立arntest协议的十一步方法,该协议将最大程度地提高准确性,适用性,降低成本并降低成本。裸板的热循环测试中混杂数据的倾向暴露了无铅组装和返工模拟。本文介绍的方法针对无铅测试应用所面临的独特挑战,即测试导电互连和介电材料的完整性。

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