IMPACT OF REWORK ON RELIABILITY OF PLASTIC BALL GRID ARRAYS SUBJECTED TO MECHANICAL BEND TEST

机译：机械弯曲试验对塑料球格栅阵列可靠性的影响

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Rework of an electronic assembly is the process of restoringrnthe functional and physical characteristics of interconnectsrnwhen defects are found during inspection without deviatingrnfrom initial design specifications. Rework is an integralrnprocess in the electronics industry used to increase yields.rnRework technologies were developed around lead-basedrnsolders with a strong understanding of the impact on postreworkrnreliability. With the shift to lead-free electronics, anrnassessment of the reliability of reworked components isrnessential before implementation of lead-free assemblies.rnLead-free assemblies introduce higher temperature on thernprinted circuit boards and associated components duringrnreflow. Also, rework processes such as component removal,rnsite redressing and replacement introduce the printed wiringrnassembly to high temperatures. This paper addresses thernimpact of rework processes on the reliability of componentsrnunder mechanical tests. The study found that after reworkrnthere was no statistical difference in durability betweenrnlead-free solders and lead-based solders under mechanicalrncycling. However, the yield is significantly lower for threetimernreworked locations for lead-free assemblies whenrncompared to lead-based assemblies.

机译：电子组件的返工是在检查过程中发现缺陷而不偏离初始设计规格时恢复互连的功能和物理特性的过程。返工是电子行业中用来提高良率的整体过程。返工技术是围绕铅基焊料开发的，它对返工后可靠性的影响有深刻的了解。随着向无铅电子技术的转变，在实施无铅组件之前对重新加工的组件的可靠性进行评估是很重要的。无铅组件会在回流期间在印制电路板和相关组件上引入更高的温度。同样，返工过程（例如部件拆卸，现场修复和更换）将印刷线路组件引入高温。本文讨论了返工过程对机械测试下部件可靠性的影响。研究发现，返修后，无铅焊料和铅基焊料在机械循环下的耐久性没有统计学差异。然而，与基于铅的组件相比，对于无铅组件的三个时间返工的位置，成品率显着降低。

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来源
《International conference on soldering amp; reliability》|2009年|p.1-6|共6页
会议地点 Toronto(CA)
作者
Vikram Srinivas; Moustafa Al-Bassyiouni; Michael Osterman; Michael Pecht;
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作者单位

Center for Advanced Life Cycle Engineering, Department of Mechanical EngineeringrnUniversity of MarylandrnCollege Park, MD, USA;

Center for Advanced Life Cycle Engineering, Department of Mechanical EngineeringrnUniversity of MarylandrnCollege Park, MD, USA;

Center for Advanced Life Cycle Engineering, Department of Mechanical EngineeringrnUniversity of MarylandrnCollege Park, MD, USA;

Center for Advanced Life Cycle Engineering, Department of Mechanical EngineeringrnUniversity of MarylandrnCollege Park, MD, USA;

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会议组织
原文格式 PDF
正文语种 eng
中图分类半导体器件制造工艺及设备;电子元件、组件;
关键词
Lead-free electronics; Rework process; BGA; rnMechanical Bend test; Weibull analysis;

机译：无铅电子；返修过程； BGA； rn机械弯曲测试； Weibull分析;

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1. Scanning Electron Microscopy Study of the Cross Section of Intermetallic Compound in the Solder Ball on the Plastic Ball Grid Array Package Following Reliability Tests [J] . YEH-FANG DUANN, JEN-HUNG CHIANG, SHUNG-JIM YANG, Journal of Electronic Materials . 2005,第7期

机译：可靠性测试后，对塑料球栅阵列封装上的焊球中金属间化合物的横截面进行扫描电子显微镜研究
2. Lead-Free BGA Rework - The choice of rework technique can affect the reliability of ball grid arrays assembled with lead-free solder [J] . Ray Cirimele Assembly . 2006,第11期

机译：无铅BGA返工-返工技术的选择会影响用无铅焊料组装的球栅阵列的可靠性
3. Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions [J] . Lau J.H. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1996,第4期

机译：倒装芯片和塑料球栅阵列组件在热，机械和振动条件下的焊点可靠性
4. IMPACT OF REWORK ON RELIABILITY OF PLASTIC BALL GRID ARRAYS SUBJECTED TO MECHANICAL BEND TEST [C] . Vikram Srinivas, Moustafa Al-Bassyiouni, Michael Osterman, International Conference on Soldering and Reliability . 2009

机译：返工对机械弯曲试验塑料球栅阵列可靠性的影响
5. Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies. [D] . Zhang, Xiaowu. 1999

机译：塑料球栅阵列（PBGA）和底铅塑料（BLP）组件的焊点可靠性。
6. A biomechanical analysis of plate fixation using unicortical and bicortical screws in transverse metacarpal fracture models subjected to 4-point bending and dynamical bending test [O] . Eirini Liodaki, Robert Wendlandt, Klaus Waizner, -1

机译：经四点弯曲和动力弯曲试验的掌骨横断骨折模型中使用单皮质螺钉和双皮质螺钉固定板的生物力学分析
7. Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test [O] . Akihiro YAGUCHI, Munehiro YAMADA, Kenichi YAMAMOTO 2003

机译：冲击弯曲试验的球栅阵列型包装中焊点的可靠性评估

IMPACT OF REWORK ON RELIABILITY OF PLASTIC BALL GRID ARRAYS SUBJECTED TO MECHANICAL BEND TEST

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