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首页> 外文会议>International conference on soldering amp; reliability >NANOBOND? ASSEMBLY – A RAPID, ROOM TEMPERATURE SOLDERING PROCESS
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NANOBOND? ASSEMBLY – A RAPID, ROOM TEMPERATURE SOLDERING PROCESS

机译：NANOBOND？组装–快速，室温的焊接工艺

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摘要

Reactive NanoTechnologies (RNT) has developed a newrntechnology that will revolutionize how manufacturers joinrncomponents using solder materials. (See Figure 1) Thernjoining process is based on the use of reactive multilayerrnfoils as local heat sources. The foils are a new class ofrnnano-engineered materials, in which self-propagatingrnexothermic reactions can be ignited at room temperaturernthrough an ignition process. By inserting a multilayer foilrnbetween two solder layers and two components, heatrngenerated by the reaction in the foil melts the solder andrnconsequently bonds the components. The joining processrncan be completed at room temperature in air, argon orrnvacuum in approximately one second. The resultingrnmetallic joints exhibit thermal conductivities two ordersrnof magnitude higher, and thermal resistivities an order ofrnmagnitude lower, than current commercial TIMs.rnThe use of reactive foils as a local heat source eliminatesrnthe need for torches, furnaces, or lasers, speeds thernsoldering processes, and dramatically reduces the totalrnheat that is needed. Thus, temperature-sensitive or smallrncomponents can be joined without thermal damage orrnexcessive heating. In addition, mismatches in thermalrncontraction on cooling can be avoided becauserncomponents see very small increases in temperature. Thisrnis particularly beneficial for joining metals to ceramics. Thernfabrication and characterization of the reactive foils isrndescribed, and the value proposition for NanoBonding isrnpresented. This paper also shows the applicability of thisrnplatform technology to many areas of packaging includingrnThermal Interface Materials, microelectronics,rnoptoelectronics, and Light Emitting Diodes (LEDs).
机译：活性纳米技术（RNT）已开发出一种新技术，它将彻底改变制造商使用焊料材料连接组件的方式。 （见图1）。连接过程是基于使用反应性多层箔作为局部热源。箔是一类新型的纳米工程材料，其中自蔓延的放热反应可以在室温下通过点火过程来点燃。通过在两个焊料层和两个组件之间插入多层箔，箔中反应产生的热量使焊料熔化，从而使组件粘合。可以在室温，空气，氩气或氩气中于大约一秒钟内完成连接过程。与目前的商用TIM相比，由此产生的金属接头表现出的热导率高出两个数量级，而热阻则降低了一个数量级。使用反应性箔片作为局部热源消除了对焊炬，熔炉或激光的需求，从而加快了焊接过程，并显着提高了焊接效率减少所需的总热量。因此，可以连接温度敏感或较小的组件，而不会造成热损坏或过度加热。另外，由于部件的温度升高很小，因此可以避免冷却时的热收缩不匹配。这对于将金属连接到陶瓷特别有利。描述了反应性箔的制备和表征，提出了纳米键合的价值主张。本文还展示了该平台技术在包装的许多领域的适用性，包括热界面材料，微电子学，超光电学和发光二极管（LED）。

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