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首页> 外文会议>International conference on soldering amp; reliability >FLUID FLOW MECHANICS – NEW ADVANCES IN LOW STANDOFF CLEANING
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FLUID FLOW MECHANICS – NEW ADVANCES IN LOW STANDOFF CLEANING

机译：流体流动机理–低停机清洗的新进展

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The associated increase in the complexity of componentsrnin the electronics industry results in a continuous decreasernin standoff spacing between the components and thernsubstrate’s surface. At the same time, the requirements forrnthe product reliability and life expectation are continuouslyrnincreasing, especially in the case of RF Technology. Thisrnin turn makes cleaning mandatory and the question arisesrnas to which cleaning process can provide the requiredrncleanliness levels under narrow capillary spaces. A suitablerncleaning process should not only allow the cleaning mediarnample access to tight spaces, but it also has to removerncontamination and discourage re-contamination. Newrninnovative approaches are now being introduced to furtherrnaddress this increase in cleaning demand. These includerninnovations on the mechanical side as well as on thernchemical. Chip components for example are currentlyrnplacing the highest demand on removability as gaps arernbeing reduced to less than 1 MIL. The presence of thernlatest chip components (i.e. 0201, 01005 and 01812)rncombined with other geometric obstacles has been noticedrnin the cleaning community. As such challenges emerge,rnusers must therefore first determine that residues arerncleanable by the cleaning agent of choice before evenrnaddressing this new geometric challenge. This paper is thernthird in a series of experimental data to be presented thatrnwill help users to overcome their respective cleaningrnissues. These findings are based on specifically designedrncleaning fluids, developed through fluid mechanicrnmodeling for the highest currently known cleaningrnrequirements. Latest product technologies available in thernmarket were compared to benchmark our findings.
机译：在电子行业中，随着组件复杂度的增加，导致组件与基板表面之间的间距逐渐减小。同时，对产品可靠性和使用寿命的要求也在不断提高，特别是在射频技术领域。这继而使清洁成为强制性的问题，并且提出了在狭窄的毛细管空间内清洁过程可以提供所需清洁度水平的问题。适当的清洁过程不仅应允许清洁介质进入狭窄的空间，而且还必须清除污染并阻止再次污染。现在正在引入新的创新方法，以进一步解决清洁需求的增长。这些包括机械方面和化学方面的创新。例如，随着间隙被减小到小于1百万，芯片组件正在满足对可移动性的最高要求。在清洁界已经注意到存在与其他几何障碍结合在一起的最新的芯片组件（即0201、01005和01812）。因此，随着挑战的出现，使用者必须首先确定残留物是否可以用所选的清洁剂清洗，然后再解决这一新的几何挑战。本文是将要提供的一系列实验数据的第三部分，这些数据将帮助用户克服各自的清洁问题。这些发现是基于专门设计的清洁液，该清洁液是通过流体力学建模开发的，用于满足目前已知的最高清洁要求。比较了Thernmarket中可用的最新产品技术，以对我们的发现进行基准测试。

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