Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

机译：热冲击下带有底部填充的Sn-Ag-Cu倒装芯片封装的可靠性

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Thermal fatigue properties of solder joints encapsulated with underfill were studied conducting thermal shock tests. Flip chip package with electroless nickel-immersion gold plated on FR-4 substrate and the Sn-3.0Ag-0.5Cu solder ball was used. The fatigue property of package with underfill was better than the package without it. The fatigue property of package with underfill which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) was better than that of package with underfill with lower Tg and higher CTE.

机译：通过热冲击试验研究了填充有底部填充胶的焊点的热疲劳性能。使用在FR-4衬底上镀有化学镍浸金的倒装芯片封装和Sn-3.0Ag-0.5Cu焊球。有底部填充的包装的疲劳性能要好于没有底部填充的包装。具有较高玻璃化转变温度（Tg）和较低热膨胀系数（CTE）的底部填充包装的疲劳性能优于具有较低Tg和较高CTE的底部填充包装的疲劳性能。

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来源
《International Symposium on Eco-Materials Processing amp; Design; 20060108-11; Chengdu(CN)》|2006年|P.558-561|共4页
会议地点 Chengdu(CN)
作者
Bo-In Noh; Seung-Boo Jung;
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作者单位

Department of Advanced Materials Engineering, Sungkyunkwan University 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea;

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会议组织
原文格式 PDF
正文语种 eng
中图分类工程材料一般性问题;
关键词
flip chip package; Sn-Ag-Cu solder; underfill; thermal shock; thermal fatigue;

机译：倒装芯片封装; Sn-Ag-Cu焊料;底部填充;热冲击;热疲劳;

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专利

1. Reliability of Flip Chip Package with Underfills under Thermal Shock [J] . Bo-In Noh, Seung-Boo Jung Key Engineering Materials . 2006,第Pt2期

机译：热冲击下带有底部填充的倒装芯片封装的可靠性
2. Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill [J] . Bo-In Noh, Bo-Young Lee, Seung-Boo Jung Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2008,第483a484期

机译：底部填充Sn-Ag-Cu芯片级封装的热疲劳性能
3. Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique [J] . Lee WS, Han IY, Yu J, Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems . 2007,第1a2期

机译：使用新型温度感应技术的倒装芯片封装导热底部填充材料的热特性
4. Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock [C] . Bo-In Noh, Seung-Boo Jung, Department of Science and Technology Sichuan Province(CN), International Symposium on Eco-Materials Processing Design . 2006

机译：SN-AG-CU倒装芯片封装在热冲击下填充底部的可靠性
5. Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip-chip packages. [D] . Sham, Man-Lung. 2003

机译：倒装芯片封装中的底部填充粘合特性，残余应力和热应力分析。
6. Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints [O] . Jiajie Fan, Jie Wu, Changzhen Jiang, 2020

机译：随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
7. Reliability of Flip Chip Package^^mdash;Thermal Stress on Flip Chip Joint^^mdash; [O] . Yutaka Tsukada 2013

机译：倒装芯片封装的可靠性^ ^ mdash;倒装芯片关节的热应力^ ^ mdash;
8. Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials. [R] . J. Suh 2013

机译：Xilinx倒装芯片CCGa封装失效分析物理：任务环境对Lp2底部填充和aTI盖层粘接材料性能的影响。

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

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