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首页> 外文会议>International Symposium on Eco-Materials Processing amp; Design; 20060108-11; Chengdu(CN) >A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages
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A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages

机译：一种用于大功率短波长发光二极管封装的选择环氧树脂模塑料的简单可靠方法

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摘要

Epoxy molding compounds (EMC) with higher thermal stabilities are urgently needed as the light emitting diode (LED) becomes brighter and the wavelength of the its light becomes shorter. This paper proposes a simple reliable method of evaluating the thermal stabilities of commercial EMCs. The transmittances of most commercial EMC samples for high power short wavelength LED packages were decreased by heat treatment at 150℃ for 200hr. Also the thermal stabilities of the samples were confirmed by measuring the weight losses through TGA. The experimental results suggest that employing a good heatsink is indispensable in highly bright short wavelength LED packages.
机译：随着发光二极管（LED）变得更亮并且其光的波长变得更短，迫切需要具有更高热稳定性的环氧模塑化合物（EMC）。本文提出了一种评估商用EMC热稳定性的简单可靠方法。在150℃下热处理200小时，大多数商用EMC样品对高功率短波长LED封装的透射率会降低。另外，通过测量通过TGA的重量损失来确认样品的热稳定性。实验结果表明，在高亮度短波长LED封装中，采用良好的散热器是必不可少的。

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