【24h】

Study of Oxygen Precipitation and Internal Gettering in Heavily As-doped Silicon Crystal

机译:重掺杂硅晶体中氧的沉淀和内部吸杂的研究

获取原文
获取原文并翻译 | 示例

摘要

In this paper, the behavior of oxygen precipitation in the silicon wafers heavily doped with As after annealing were studied. The experimental results showed that the nucleation temperature of the oxygen precipitates and induced-defects in heavily As-doped Si is about 900℃. And when annealing at moderate and high temperature, the density of oxygen precipitates is higher. Both the size and density of oxygen precipitates increase with annealing time, the size decreases with the annealing temperature. TEM showed that the faults and dislocation loops induced by the oxygen precipitates were formed when the wafers were annealed at moderate temperature, and polyhedral oxygen precipitates was generated at high temperature. An improved internal gettering process was suggested for the heavily As-doped silicon.
机译:本文研究了退火后重掺杂砷的硅片中氧沉淀的行为。实验结果表明,高掺砷硅中氧的析出和诱导缺陷的成核温度约为900℃。并且,当在中等和高温下退火时,氧沉淀的密度更高。氧析出物的尺寸和密度均随退火时间的增加而增加,尺寸随退火温度的降低而减小。 TEM表明,当在中等温度下对晶片进行退火时,由氧沉淀物引起的断层和位错环形成,并且在高温下产生多面体氧沉淀物。对于重掺杂砷的硅,提出了一种改进的内部吸杂工艺。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号